Coil unit and electronic instrument

• US 8,269,595 B2
• Filed: 07/10/2008
• Issued: 09/18/2012
• Est. Priority Date: 07/11/2007
• Status: Active Grant

• Current Assignee: 138 East LCD Advancements Limited (Vector Capital Corporation)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Okada, Hirofumi, Kondo, Yoichiro
• Primary Examiner(s): Musleh, Mohamad
• Assistant Examiner(s): Chan, Tsz
• Application Number:
  US12/170,728
• Publication Number:
  US 20090015362A1
• Time in Patent Office: 1,531 Days
• Field of Search: 336/90, 336/200, 336/232, 336/233, 336/96
• US Class Current: 336/200
• CPC Class Codes: H01F 27/2871 Pancake coils
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H02J 50/005 Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
• CPC Class Codes: H02J 50/10 using inductive coupling
• CPC Class Codes: H02J 50/70 involving the reduction of electric, magnetic or electromagnetic leakage fields
• CPC Class Codes: H02J 7/0042 characterised by the mechanical construction
• CPC Class Codes: H02J 7/0044 specially adapted for holding portable devices containing batteries H02J7/0045 takes precedence

Abstract

A coil unit includes a planar coil, a coil-receiving housing having a depression that receives the planar coil, the planar coil being disposed in the coil-receiving housing so that a transmission side of the planar coil faces a bottom of the depression, and a substrate having a mounting surface that is provided with a mounted component and faces a non-transmission side of the planar coil, an inner end lead line and an outer end lead line of the planar coil being connected to the substrate. The substrate is secured as a lid of the coil-receiving housing on an open end side of the depression of the coil-receiving housing.

Claims

1. A coil unit comprising:

a planar coil;

a coil-receiving housing having a depression that receives the planar coil, the planar coil being disposed in the coil-receiving housing so that a transmission side of the planar coil faces a bottom surface of the depression of the coil-receiving housing;

a substrate having a mounting surface that is provided with a mounted component and that faces a non-transmission side of the planar coil, an inner end lead line and an outer end lead line of the planar coil being connected to the substrate, the substrate being secured as a lid of the coil-receiving housing on an open end side of the depression of the coil-receiving housing, and the coil-receiving housing including

a receiving section that is part of the coil-receiving housing and that houses the inner end lead line provided on the transmission side of the planar coil so as to reduce an increase in the thickness of the coil unit due to the inner end lead line.

2. The coil unit as defined in claim 1,

the planar coil having an air-core section;

and

the coil-receiving housing having a positioning protrusion that positions the air-core section of the planar coil.

3. The coil unit as defined in claim 1,

the coil unit further including a magnetic sheet disposed on the non-transmission side of the planar coil,

the planar coil and the magnetic sheet being placed between the coil-receiving housing and the substrate.

4. The coil unit as defined in claim 3,

the coil unit further including a magnetic shield sheet, the magnetic shield sheet being stacked on the magnetic sheet on a side that faces the mounting surface of the substrate.

5. The coil unit as defined in claim 3,

a sealing material being provided between an outer edge of the magnetic sheet and an inner wall of the coil-receiving housing;

and

the inner end lead line and the outer end lead line of the planar coil being connected to the substrate through the sealing material.

6. The coil unit as defined in claim 1,

connection patterns connected to the inner end lead line and the outer end lead line being provided on an exposed surface of the substrate opposite to the mounting surface;

a recess being formed in an outer edge of the substrate; and

the inner end lead line and the outer end lead line being provided from the mounting surface to the exposed surface through the recess.

7. The coil unit as defined in claim 1,

connection patterns connected to the inner end lead line and the outer end lead line being provided on the mounting surface of the substrate.

8. The coil unit as defined in claim 1,

a vacuum attraction hole being formed through the bottom of the coil-receiving housing.

9. An electronic instrument comprising the coil unit as defined in claim 1.

10. A coil unit comprising:

a planar coil;

a coil-receiving housing having a depression that receives the planar coil;

a base provided with an electronic component that is electrically connected to the planar coil, an inner end lead line and an outer end lead line of the planar coil being connected to the base, the base being disposed to cover the depression of the coil-receiving housing, and the coil-receiving housing including

a receiving section that is part of the coil-receiving housing and that houses the inner end lead line that is provided on a transmission side of the planar coil so as to reduce an increase in the thickness of the coil unit due to the inner end lead line.

11. An electronic instrument comprising the coil unit as defined in claim 10.