Thermal dissipation for imager head assembly of remote inspection device
First Claim
Patent Images
1. An imager head assembly for a remote inspection device, comprising:
- an imager body;
an imager nut coupled to the imager body;
an imager cap positioned within and in direct contact with the imager nut;
a circuit board having an outer perimeter surface slidably received within and in direct contact with an inner perimeter surface of the imager cap, the circuit board having at least one light emitting diode (LED) fixedly connected thereto;
a light pipe unit slidably received in the imager cap and connected to the circuit board, the light pipe unit having at least one light pipe contacting the imager cap and coaxially positioned with respect to the at least one LED; and
a light transmissive, thermally conductive adhesive applied over all of a face of the light pipe unit, the circuit board including the at least one LED, and the outer perimeter surface of the circuit board, the adhesive fixedly retaining the circuit board to the imager nut, and fixedly retaining the light pipe unit to the imager cap, the adhesive creating a first heat transmission path conductively dissipating heat generated by the at least one LED by contact between circuit board, the imager cap, and the imager nut, and a second heat transmission path conductively dissipating heat generated by the at least one LED via the light pipe unit to the imager cap.
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Accused Products
Abstract
An imager head assembly for a remote inspection device includes an imager housing. A circuit board is positioned within the imager housing. The circuit board has a light emitting diode connected thereto. A thermally conductive material in contact with the circuit board and the imager housing creates a conductive heat transfer path to dissipate heat generated by the light emitting diode through the imager housing. A light transmissive light pipe unit can be positioned proximate the circuit board to permit light emitted by the light emitting diode to pass through the light pipe unit.
23 Citations
13 Claims
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1. An imager head assembly for a remote inspection device, comprising:
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an imager body; an imager nut coupled to the imager body; an imager cap positioned within and in direct contact with the imager nut; a circuit board having an outer perimeter surface slidably received within and in direct contact with an inner perimeter surface of the imager cap, the circuit board having at least one light emitting diode (LED) fixedly connected thereto; a light pipe unit slidably received in the imager cap and connected to the circuit board, the light pipe unit having at least one light pipe contacting the imager cap and coaxially positioned with respect to the at least one LED; and a light transmissive, thermally conductive adhesive applied over all of a face of the light pipe unit, the circuit board including the at least one LED, and the outer perimeter surface of the circuit board, the adhesive fixedly retaining the circuit board to the imager nut, and fixedly retaining the light pipe unit to the imager cap, the adhesive creating a first heat transmission path conductively dissipating heat generated by the at least one LED by contact between circuit board, the imager cap, and the imager nut, and a second heat transmission path conductively dissipating heat generated by the at least one LED via the light pipe unit to the imager cap. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An imager head assembly for a remote inspection device, comprising:
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an imager nut threadably connected to an imager body; an imager cap positioned within and in direct contact with the imager nut; a first circuit board positioned within the imager cap, the first circuit board having four equidistantly spaced high power light emitting diodes (LEDs) connected thereto operating to generate light to illuminate an object located proximate to the imager head assembly, and having an outer perimeter surface received within and in direct contact with an inner perimeter surface of the imager cap; a lens mount positioned in the imager body having multiple integrally extending alignment pins of the lens mount received in the first circuit board to non-rotatably mount the first circuit board to the lens mount; a second circuit board positioned within the imager body receiving second alignment pins of the lens mount to non-rotatably mount the second circuit board to the lens mount, the second circuit board having an imager device connected to the second circuit board, the imager device adapted to receive the light emitted by the LEDs and reflected off the object and to transmit a digital signal representing an image of the object; and a light transmissive, thermally conductive adhesive applied over all of the first circuit board including the LEDs, an outer perimeter surface of the first circuit board, and the lens mount, the adhesive fixedly connecting the first circuit board to the imager nut and the lens mount to the imager body, the adhesive creating a first heat transmission path conductively dissipating heat generated by the LEDs by contact between the first circuit board, the imager cap, and the imager nut, and a second heat transmission path conductively dissipating heat generated by the LEDs via the first circuit board, the lens mount, and the imager body. - View Dependent Claims (11, 12, 13)
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Specification