×

Thermal dissipation for imager head assembly of remote inspection device

  • US 8,269,828 B2
  • Filed: 02/27/2008
  • Issued: 09/18/2012
  • Est. Priority Date: 12/22/2006
  • Status: Active Grant
First Claim
Patent Images

1. An imager head assembly for a remote inspection device, comprising:

  • an imager body;

    an imager nut coupled to the imager body;

    an imager cap positioned within and in direct contact with the imager nut;

    a circuit board having an outer perimeter surface slidably received within and in direct contact with an inner perimeter surface of the imager cap, the circuit board having at least one light emitting diode (LED) fixedly connected thereto;

    a light pipe unit slidably received in the imager cap and connected to the circuit board, the light pipe unit having at least one light pipe contacting the imager cap and coaxially positioned with respect to the at least one LED; and

    a light transmissive, thermally conductive adhesive applied over all of a face of the light pipe unit, the circuit board including the at least one LED, and the outer perimeter surface of the circuit board, the adhesive fixedly retaining the circuit board to the imager nut, and fixedly retaining the light pipe unit to the imager cap, the adhesive creating a first heat transmission path conductively dissipating heat generated by the at least one LED by contact between circuit board, the imager cap, and the imager nut, and a second heat transmission path conductively dissipating heat generated by the at least one LED via the light pipe unit to the imager cap.

View all claims
  • 4 Assignments
Timeline View
Assignment View
    ×
    ×