Light emitting diode lamp capable of high AC/DC voltage operation

• US 8,272,757 B1
• Filed: 06/03/2005
• Issued: 09/25/2012
• Est. Priority Date: 06/03/2005
• Status: Active Grant

• Current Assignee: AC Led Lighting, LLC
• Original Assignee: AC Led Lighting, LLC
• Inventors: Fan, Zhaoyang, Jiang, Hongxing, Lin, Jingyu
• Primary Examiner(s): Dzierzynski, Evan
• Application Number:
  US11/144,982
• Time in Patent Office: 2,671 Days
• Field of Search: 362/231, 315/185.S, 315/200.A, 315/312, 315/316, 257/79, 257 81- 84, 257/86, 257/88, 257/89, 257/99, 257/100
• US Class Current: 362/231
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05B 45/42 Antiparallel configurations

Abstract

A solid-state LED lighting lamp (SSL-LED lamp), based on AC or DC-emitters, which runs under a high AC or DC voltage, with high light generation capability, high reliability and long lifespan, is disclosed. A plurality of AC or DC-emitter chips are integrated on a thermally conductive submount and the electrically conductive element pathways on the submount provide electrical interconnections between the mounted chips and also between the individual LEDs on each chip. The conducting elements also provide redundant current paths at the AC or DC-emitter chip level and individual LED level. Depending on the detail design, the LED SSL-lamp may be directly powered by an AC voltage (i.e. 110/120V or 220/240V power grid) or a high DC voltage. With this design, the LED SSL-lamp can provide sufficient illumination to replace the incandescent or florescent light bulbs for general lighting purpose. The distributed emitter array design ensures the heat dissipation. The redundant current path design ensures the long lifespan and high reliability.

Claims

1. An LED based solid-state lamp comprising:

a submount having electrically insulative properties;

conductive elements deposited on a surface of the submount; and

a plurality of high voltage LED emitters on a semiconductor chip, the emitters existing in an array on a surface on a substrate which is on an opposite side of the emitters from the surface of the submount;

the LED emitters being coupled with the surface on the submount and electrically connected with one another through the conductive elements, wherein the conductive elements are arranged in a configuration that includes a plurality of redundant conductive pathways between the emitters at the emitter level, the redundant pathways providing a ladderlike configuration of interconnections between emitters.

2. The lamp of claim 1, wherein the plurality of single-chip high voltage LED emitters are AC LED emitters, each comprising:

a semi conductive chip; and

a first set and a second set of series connected LEDs mounted to the chip, each of the first and second set of series connected LEDs having a forward biased direction of current flow, a reverse biased direction of no current flow opposite of the forward biased direction of current flow, and each set presenting positive and negative terminals;

wherein the positive terminal of the first set of series connected LEDs is connected to the negative terminal of the second set of series connected LEDs, and the negative terminal of the first set of series connected LEDs is connected to the positive terminal of the second set of series connected LEDs, such that a current from the AC power source energizes the first set of LEDs in the forward biased direction during a first half cycle of the AC power source and the current from the AC power source energizes the second set of LEDs in the forward biased direction during a second half cycle of the AC power source.

3. The lamp of claim 2, wherein the first set and second set of series connected LEDs are coupled with the submount with conductive bumps that interconnect the LEDs with the conductive elements.

4. The lamp of claim 1, wherein the plurality of single-chip high voltage LED emitters are DC LED emitters, each comprising:

a semi conductive chip having a positive electrode and a negative electrode for receiving a power source; and

a first set of series connected LEDs mounted to the chip and coupled with the positive and negative electrodes.

5. The lamp of claim 4, wherein the DC LED emitters further comprise:

at least a second set of series connected LEDs mounted to the chip and coupled with the positive and negative electrodes, each of the first and at least a second set of series connected LEDs arranged on the chip for a parallel connection with one another.

6. The lamp of claim 4, wherein the first set of series connected LEDs are coupled with the submount with conductive bumps that interconnect the LEDs with the conductive elements.

7. The lamp of claim 1, wherein the conductive elements are arranged on the submount so that the plurality of single-chip high voltage LED emitters are connected in series with one another.

8. The lamp of claim 1, wherein the conductive elements are arranged on the submount so that the plurality of single-chip high voltage LED emitters are connected in parallel with one another.

9. The lamp of claim 1, wherein the conductive elements are arranged on the submount so that that the plurality of single-chip high voltage LED emitters are connected in both series and in parallel with one another.

10. The lamp of claim 1, wherein the conductive elements are configured to provide one direction current flow through the plurality of single-chip high voltage LED emitters for DC voltage.

11. The lamp of claim 1, wherein the conductive pathways interconnect the plurality of LEDs in both series and in parallel with one another.

12. The lamp of claim 1, wherein the submount is formed of a thermally conductive material.

13. The lamp of claim 12, wherein the submount is formed from a thermally conductive material selected from the group consisting of aluminum nitride, boron nitride, ceramics, or silicon-based materials.

14. The lamp of claim 1, wherein the submount has an electrically conductive portion covered by an electrically insulating layer.

15. The lamp of claim 1, wherein the submount is formed from materials selected from the group consisting of low-temperature co-fired ceramic-on-metal (LTCC-M), aluminum silicon carbide (AlSiC) metal matrix composite materials, or metal-core board.

16. The lamp of claim 1, further comprising protective elements coupled to the submount for controlling power supplied to the plurality of single-chip high voltage LED emitters.

17. The lamp of claim 16, wherein the protective elements are selected from the group consisting of varistors, current limiting resistors or positive temperature coefficient thermistors.

18. The lamp of claim 1, wherein the plurality of single-chip high voltage LED emitters emit varying wavelengths of light.

19. The lamp of claim 1, wherein at least some of the plurality of single-chip high voltage LED emitters are encapsulated together on the substrate to isolate the encapsulated LED emitters from the surrounding environment as well as positive and negative terminals where a power source is connected to the substrate.

20. An LED based 110V/120V AC-SSL-lamp comprising:

a substrate including a plurality of high voltage LED emitters arranged in an m×

n matrix (m≧

1, n≧

1);

a submount having electrically insulative properties; and

conductive elements disposed on a surface of the submount;

wherein the LED emitters are mounted on a surface on the substrate which is on an opposite side of the emitters from the surface of the submount; and

wherein the LED emitters are electrically connected with one another through the conductive elements via ladder-like vertical and horizontal redundant segments that form at least two redundant flow paths between a first LED emitter and a second LED emitter within the matrix.

21. The lamp of claim 20, wherein the conductive elements are arranged on the submount so that the plurality of LED emitters are connected in parallel with one another.

22. The lamp of claim 20, wherein the conductive elements interconnect the plurality of LEDs in series with one another.

23. The lamp of claim 20, wherein the plurality of LED emitters include at least a first portion of LED emitters constructed of materials producing a first type of color emission, and a second portion of LED emitters constructed of materials producing a second type of color emission, wherein the combinations of the first and second types of color emissions appear to the human eye to be a white light emission.

24. An LED based 220V/240V AC-SSL-lamp comprising:

a substrate including a plurality of AC LED emitters arranged in m×

n matrix format (m≧

1, n≧

1);

a submount having electrically insulative properties; and

conductive elements disposed on a surface of the submount;

wherein the AC LED emitters on the substrate are flip-chip mounted onto the submount, the AC LED emitters each being mounted on a surface of the substrate, the surface of the substrate being opposite the surface of the submount; and

wherein the AC LED emitters are electrically interconnected through the conductive elements such that every AC LED emitter is connected both in parallel in series with at least one other AC LED emitter in a ladder configuration to create redundant current paths on the chip level.