Light emitting diode lamp capable of high AC/DC voltage operation
First Claim
1. An LED based solid-state lamp comprising:
- a submount having electrically insulative properties;
conductive elements deposited on a surface of the submount; and
a plurality of high voltage LED emitters on a semiconductor chip, the emitters existing in an array on a surface on a substrate which is on an opposite side of the emitters from the surface of the submount;
the LED emitters being coupled with the surface on the submount and electrically connected with one another through the conductive elements, wherein the conductive elements are arranged in a configuration that includes a plurality of redundant conductive pathways between the emitters at the emitter level, the redundant pathways providing a ladderlike configuration of interconnections between emitters.
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Accused Products
Abstract
A solid-state LED lighting lamp (SSL-LED lamp), based on AC or DC-emitters, which runs under a high AC or DC voltage, with high light generation capability, high reliability and long lifespan, is disclosed. A plurality of AC or DC-emitter chips are integrated on a thermally conductive submount and the electrically conductive element pathways on the submount provide electrical interconnections between the mounted chips and also between the individual LEDs on each chip. The conducting elements also provide redundant current paths at the AC or DC-emitter chip level and individual LED level. Depending on the detail design, the LED SSL-lamp may be directly powered by an AC voltage (i.e. 110/120V or 220/240V power grid) or a high DC voltage. With this design, the LED SSL-lamp can provide sufficient illumination to replace the incandescent or florescent light bulbs for general lighting purpose. The distributed emitter array design ensures the heat dissipation. The redundant current path design ensures the long lifespan and high reliability.
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Citations
24 Claims
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1. An LED based solid-state lamp comprising:
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a submount having electrically insulative properties; conductive elements deposited on a surface of the submount; and a plurality of high voltage LED emitters on a semiconductor chip, the emitters existing in an array on a surface on a substrate which is on an opposite side of the emitters from the surface of the submount; the LED emitters being coupled with the surface on the submount and electrically connected with one another through the conductive elements, wherein the conductive elements are arranged in a configuration that includes a plurality of redundant conductive pathways between the emitters at the emitter level, the redundant pathways providing a ladderlike configuration of interconnections between emitters. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. An LED based 110V/120V AC-SSL-lamp comprising:
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a substrate including a plurality of high voltage LED emitters arranged in an m×
n matrix (m≧
1, n≧
1);a submount having electrically insulative properties; and conductive elements disposed on a surface of the submount; wherein the LED emitters are mounted on a surface on the substrate which is on an opposite side of the emitters from the surface of the submount; and wherein the LED emitters are electrically connected with one another through the conductive elements via ladder-like vertical and horizontal redundant segments that form at least two redundant flow paths between a first LED emitter and a second LED emitter within the matrix. - View Dependent Claims (21, 22, 23)
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24. An LED based 220V/240V AC-SSL-lamp comprising:
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a substrate including a plurality of AC LED emitters arranged in m×
n matrix format (m≧
1, n≧
1);a submount having electrically insulative properties; and conductive elements disposed on a surface of the submount; wherein the AC LED emitters on the substrate are flip-chip mounted onto the submount, the AC LED emitters each being mounted on a surface of the substrate, the surface of the substrate being opposite the surface of the submount; and wherein the AC LED emitters are electrically interconnected through the conductive elements such that every AC LED emitter is connected both in parallel in series with at least one other AC LED emitter in a ladder configuration to create redundant current paths on the chip level.
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Specification