Patterning methodology for uniformity control
First Claim
1. A method of fabricating a semiconductor device, comprising:
- forming a polysilicon layer over a substrate, the substrate having a topography variation;
forming a first layer over the polysilicon layer, the first layer having a thickness that substantially exceeds the topography variation of the substrate;
forming a second layer over the first layer;
patterning the second layer to form a patterned second layer that has a plurality of components separated by a plurality of openings;
patterning the first layer with the patterned second layer to form a patterned first layer; and
patterning the polysilicon layer with the patterned first layer.
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Abstract
The present disclosure provides a method of fabricating a semiconductor device. The method includes forming a patternable layer over a substrate. The method includes forming a first layer over the patternable layer. The method includes forming a second layer over the first layer. The second layer is substantially thinner than the first layer. The method includes patterning the second layer with a photoresist material through a first etching process to form a patterned second layer. The method includes patterning the first layer with the patterned second layer through a second etching process to form a patterned first layer. The first and second layers have substantially different etching rates during the second etching process. The method includes patterning the patternable layer with the patterned first layer through a third etching process.
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Citations
20 Claims
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1. A method of fabricating a semiconductor device, comprising:
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forming a polysilicon layer over a substrate, the substrate having a topography variation; forming a first layer over the polysilicon layer, the first layer having a thickness that substantially exceeds the topography variation of the substrate; forming a second layer over the first layer; patterning the second layer to form a patterned second layer that has a plurality of components separated by a plurality of openings; patterning the first layer with the patterned second layer to form a patterned first layer; and patterning the polysilicon layer with the patterned first layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of fabricating a semiconductor device, comprising:
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forming a patternable layer over a substrate; forming a first layer over the patternable layer; forming a second layer over the first layer, the first and second layers having different material compositions and substantially different thicknesses; performing a first etching process to the second layer to form a plurality of second layer components, wherein at least a subset of the second layer components each define a critical dimension of the semiconductor device; performing a second etching process to the first layer to form a plurality of first layer components, wherein the second etching process is performed using the second layer components as etching masks; and performing a third etching process to the patternable layer, wherein the third etching process is performed using the first layer components as etching masks. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A method of fabricating a semiconductor device, comprising:
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forming a polysilicon layer over a substrate, the substrate having an amount of variation in topography; forming an anti-reflective layer over the polysilicon layer, the anti-reflective layer being multiple times thicker than the amount of variation in the topography of the substrate; forming a sacrificial layer over the anti-reflective layer, the sacrificial layer being substantially thinner than the anti-reflective layer; patterning the sacrificial layer to form a plurality of sacrificial features, wherein at least one of the sacrificial features has a width that is a function of a critical dimension of the semiconductor device; patterning the anti-reflective layer using the sacrificial features as masks; and thereafter patterning the polysilicon layer using the patterned anti-reflective layer. - View Dependent Claims (17, 18, 19, 20)
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Specification