Light emitting diode lighting device

• US 8,274,241 B2
• Filed: 02/04/2009
• Issued: 09/25/2012
• Est. Priority Date: 02/06/2008
• Status: Expired due to Fees

• Current Assignee: C Crane Company Incorporated
• Original Assignee: C Crane Company Incorporated
• Inventors: Guest, Ralph E., Johansen, Jarl J.
• Primary Examiner(s): Chang, Daniel D
• Application Number:
  US12/365,862
• Publication Number:
  US 20090195186A1
• Time in Patent Office: 1,329 Days
• Field of Search: 315/294, 315/291, 362/85, 362/294, 362/373, D26/2, 313/11, 313/13, 313/46
• US Class Current: 315/294
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/238 Arrangement or mounting of circuit elements integrated in the light source
• CPC Class Codes: F21V 17/164 the parts being subjected to bending, e.g. snap joints
• CPC Class Codes: F21V 23/002 Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
• CPC Class Codes: F21V 23/006 the substrate being distinct from the light source holder
• CPC Class Codes: F21V 29/77 with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
• CPC Class Codes: F21V 3/061 the material being glass
• CPC Class Codes: F21V 3/062 the material being plastics
• CPC Class Codes: F21Y 2107/40 on the sides of polyhedrons, e.g. cubes or pyramids
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05B 45/32 Pulse-control circuits
• CPC Class Codes: H05B 45/355 Power factor correction [PFC]; Reactive power compensation
• CPC Class Codes: H05B 45/3577 Emulating the dimming characteristics, brightness or colour temperature of incandescent lamps
• CPC Class Codes: H05B 45/375 using buck topology
• CPC Class Codes: H05B 45/56 involving measures to prevent abnormal temperature of the LEDs
• CPC Class Codes: Y02B 20/30 Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

A lighting device comprises a mounting head having multiple facets each configured to retain an associated Light Emitting Diode (LED). The LEDs are mounted to the facets with a thermally conductive metal pad and thermally conductive adhesive. A connector for the lighting device inserts into a light socket and receives power for operating the LEDs. A heat transfer body is coupled between the mounting head and the connector and transfer heat generated by the LEDs downward from the mounting head and then radially outward. The mounting head, adhesive, metal pad, and heat transfer body form a heat transfer structure that more effectively removes heat generated by the LEDs. In one embodiment, a dimmer circuit is also provided that allows the LED lighting device to operate with conventional dimmer switches.

Claims

1. A lighting device, comprising:

a mounting head having multiple facets each configured to retain an associated Light Emitting Diode (LED), the facets having upwardly inclining angles that extend radially outward;

a light cover extending over the mounting head;

a connector configured to insert into a light socket and receive power for operating to the LEDs; and

a heat sink body located between the mounting head and the connector configured to sink heat generated by the LEDs downward and outward from the mounting head, wherein the heat sink body is formed from one continuous piece of material with the mounting head and includes an elongated lower section having a solid internal body and a continuous outside surface that extends between and around a bottom end of the light cover and a top end of the connector.

2. The lighting device according to claim 1 wherein the lower section of the heat sink body is formed with an upper section that extends down from the mounting head and out through the bottom end of the light cover.

3. The lighting device according to claim 1 including elongated ridges formed with the lower section of the heat sink body and extending along substantially an entire vertical length of the outside surface of the lower section of the heat sink body.

4. The lighting device according to claim 3 wherein the ridges are configured to promote heat transfer downward from the mounting head, through the heat sink body, and radially outward from around the entire outside surface of the lower section of the heat sink body.

5. The lighting device according to claim 1 further comprising multiple individually foamed metal thermal transfer pads individually and separately coupled between the facets and the associated LEDs.

6. The lighting device according to claim 5 further comprising a thermally conductive adhesive configured to provide a thermally conductive path between the metal thermal transfer pads and the facets.

7. The lighting device according to claim 6 wherein the thermally conductive adhesive is glue with high thermal conductivity, high electrical insulation, and low out gassing.

8. The lighting device according to claim 1 wherein the light cover is configured to mount onto a top end of the lower section of the heat sink body.

9. A Light Emitting Diode (LED) lighting device, comprising:

a mounting head configured to hold LEDs;

a cover configured to extend over the LEDs; and

a continuous solid heat sink body comprising a top portion forming the mounting head and a bottom portion extending down from the mounting head and out through a bottom end of the cover, wherein the heat sink body comprises a same continuous unitary piece of material forming the bottom portion and the top portion and wherein the bottom portion has a continuous outside surface that extends below a bottom end of the cover and above a top end of a connector.

10. The lighting device according to claim 9 further comprising elongated ridges that extend vertically along substantially an entire vertical height of the bottom portion of the heat sink body and are formed from the same continuous unitary piece of material forming the bottom portion and the top portion and extend radially around the outside surface of the bottom portion of the heat sink body.

11. The lighting device according to claim 9 wherein the mounting head and the heat sink body are formed together from a same unitary piece of aluminum and a thermally conductive adhesive is used to attach the LEDs to the mounting head.

12. A Light Emitting Diode (LED) lighting device, comprising:

a mounting head configured to hold multiple LEDs;

a cover configured to cover the LEDs;

a heat sink body formed from a same continuous piece of material used for the mounting head and extending down through and out of the cover to a connector, the heat sink body including a bottom portion that extends below and around a bottom end of the cover and sits above and on top of the connector; and

elongated fins extending vertically along the bottom portion of the heat sink body and formed from the same continuous piece of material used for the mounting head and heat sink body and extending radially around an outside surface of the bottom portion of the heat sink body.

13. The lighting device according to claim 12 wherein the cover is configured to mount onto a top end of the bottom portion of the heat sink body.