Image-capturing module for simplifying optical component

• US 8,274,594 B2
• Filed: 01/13/2010
• Issued: 09/25/2012
• Est. Priority Date: 09/09/2009
• Status: Expired due to Fees

• Current Assignee: Azurewave Technologies, Inc.
• Original Assignee: Azurewave Technologies, Inc.
• Inventors: Hsu, Chi-Hsing, Chen, Chin-Chien
• Primary Examiner(s): Jerabek, Kelly L
• Assistant Examiner(s): PRABHAKHER, PRITHAM DAVID
• Application Number:
  US12/686,915
• Publication Number:
  US 20110058092A1
• Time in Patent Office: 986 Days
• Field of Search: 348335-369, 340 582- 583, 382115-116
• US Class Current: 348/340
• CPC Class Codes: G06V 40/1324 by using geometrical optics, e.g. using prisms G06V40/1312 takes precedence
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

An image-capturing module for simplifying optical component includes a first substrate unit, an image-capturing unit, an optical imaging unit, a second substrate unit, a light-emitting unit and a cover unit. The second substrate unit is disposed on the outer surface of the optical imaging unit and electrically connected to the first substrate unit. The light-emitting unit has a light-emitting element electrically disposed on the second substrate unit. The cover unit has a reflective layer formed on an inner surface thereof. Therefore, the light beams generated by the light-emitting element are reflected by the reflective layer to form first reflected light beams projected onto the object, then the first reflected light beams are reflected by the object to form second reflected light beams projected onto the optical imaging unit, and then the second reflected light beams pass through the optical imaging unit and project onto the image-capturing unit.

Claims

1. An image-capturing module comprising:

a first substrate unit;

an image-capturing unit including an image-capturing element disposed on the first substrate unit and electrically connected to the first substrate unit;

an optical imaging unit disposed on the first substrate unit to cover the image-capturing unit, wherein the optical imaging unit has at least one first inclined surface formed on an outer surface thereof and at least one reflective layer disposed on the at least one first inclined surface;

a cover unit disposed on the first substrate unit to cover the optical imaging unit, wherein the cover unit includes a light-transmitting element disposed above the optical imaging unit, and the cover unit has at least one second inclined surface formed on an inner surface thereof;

a second substrate unit disposed on the at least one second inclined surface of the cover unit and electrically connected to the first substrate unit; and

a light-emitting unit including at least one light-emitting element disposed on the second substrate unit and electrically connected to the second substrate unit for generating light beams;

wherein an object is disposed on the light-transmitting element, the light beams generated by the at least one light-emitting element are projected onto the at least one reflective layer and reflected by the at least one reflective layer to form first reflected light beams, the first reflected light beams are projected onto the object through the light-transmitting element and reflected by the object to form second reflected light beams, and then the second reflected light beams are projected onto the image-capturing element through the optical imaging unit.

2. The image-capturing module according to claim 1, wherein the first substrate unit and the second substrate unit are printed circuit boards, and the image-capturing element is an image sensor.

3. The image-capturing module according to claim 1, wherein the light-emitting element is a light emitting diode.

4. The image-capturing module according to claim 1, wherein the reflective layer is a reflective element adhered to the inner surface of the cover unit or a reflective coated film coated on the inner surface of the cover unit.

5. An image-capturing module comprising:

a substrate unit having a bended end portion;

an image-capturing unit including an image-capturing element disposed on the substrate unit and electrically connected to the substrate unit;

an optical imaging unit disposed on the substrate unit to cover the image-capturing unit, wherein the optical imaging unit has at least one first inclined surface formed on an outer surface thereof, and the bended end portion of the substrate unit is bent and disposed on the at least one first inclined surface of the optical imaging unit;

a light-emitting unit including at least one light-emitting element disposed on the bended end portion of the substrate unit and electrically connected to the bended end portion of the substrate unit for generating light beams; and

a cover unit disposed on the substrate unit to cover the optical imaging unit and the light-emitting unit, wherein the cover unit includes a light-transmitting element disposed above the optical imaging unit, and the cover unit has at least one second inclined surface formed on an inner surface thereof and at least one reflective layer disposed on the at least one second inclined surface;

wherein an object is disposed on the light-transmitting element, the light beams generated by the at least one light-emitting element are projected onto the at least one reflective layer and reflected by the at least one reflective layer to form first reflected light beams, the first reflected light beams are projected onto the object through light-transmitting element and reflected by the object to form second reflected light beams, and then the second reflected light beams are projected onto the image-capturing unit through the optical imaging unit.

6. The image-capturing module according to claim 5, wherein the substrate unit is a printed circuit board, and the image-capturing element is an image sensor.

7. The image-capturing module according to claim 5, wherein the light-emitting element is a light emitting diode.

8. The image-capturing module according to claim 5, wherein the reflective layer is a reflective element adhered to the inner surface of the cover unit or a reflective coated film coated on the inner surface of the cover unit.

9. An image-capturing module comprising:

a substrate unit having a bended end portion;

an image-capturing unit including an image-capturing element disposed on the substrate unit and electrically connected to the substrate unit;

an optical imaging unit disposed on the substrate unit to cover the image-capturing unit, wherein the optical imaging unit has at least one inclined surface formed on an outer surface thereof, and the bended end portion of the substrate unit is bent and disposed on the at least one inclined surface of the optical imaging unit;

a light-emitting unit including at least one light-emitting element disposed on the bended end portion of the substrate unit and electrically connected to the bended end portion of the substrate unit for generating light beams; and

a cover unit disposed on the substrate unit to cover the optical imaging unit and the light-emitting unit, wherein the cover unit includes a light-transmitting element disposed above the optical imaging unit;

wherein an object is disposed on the light-transmitting element, the light beams generated by the at least one light-emitting element are projected onto the object through light-transmitting element and reflected by the object to form reflected light beams, and then the reflected light beams are projected onto the image-capturing unit through the optical imaging unit.

10. The image-capturing module according to claim 9, wherein the substrate unit is a printed circuit board, and the image-capturing element is an image sensor.

11. The image-capturing module according to claim 9, wherein the light-emitting element is a light emitting diode.