Display device comprising a protective fixing member disposed only about a periphery of a semiconductor chip wherein a top side and a bottom side are co-planar with a respective top side and a bottom side of the semiconductor chip

• US 8,274,633 B2
• Filed: 03/12/2007
• Issued: 09/25/2012
• Est. Priority Date: 03/14/2006
• Status: Active Grant

• Current Assignee: Japan Display West Incorporated (Japan Display Incorporated)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Ino, Masumitsu
• Primary Examiner(s): Healy, Brian M.
• Assistant Examiner(s): LEE, PAUL CHANG
• Application Number:
  US11/684,867
• Publication Number:
  US 20080143949A1
• Time in Patent Office: 2,024 Days
• Field of Search: 349150-154
• US Class Current: 349/150
• CPC Class Codes: G02F 1/133308 Support structures for LCD panels, e.g. frames or bezels
• CPC Class Codes: G02F 1/133528 Polarisers
• CPC Class Codes: G02F 1/13363 Birefringent elements, e.g. for optical compensation
• CPC Class Codes: G02F 1/1339 Gaskets; Spacers; Sealing of cells
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: G02F 1/13454 Drivers integrated on the active matrix substrate G02F1/136277 takes precedence
• CPC Class Codes: G02F 1/1368 in which the switching element is a three-electrode device G02F1/136277 takes precedence
• CPC Class Codes: G02F 2201/50 Protective arrangements
• CPC Class Codes: H01J 9/20 Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel

Abstract

Disclosed herein is a display device including: a first substrate with a pixel switch and drivers mounted thereon; a second substrate disposed in facing relation to the first substrate; a material layer held between the first substrate and the second substrate and having peripheral edges sealed by a seal member, the material layer having an electrooptical effect; and a semiconductor chip mounted as a COG component on the first substrate, the semiconductor chip having a control system configured to control the drivers; wherein the semiconductor chip having a thickness equal to the total thickness of the seal member and the second substrate or larger than the thickness of the seal member and smaller than the total thickness.

Claims

1. A display device comprising:

a first substrate with a pixel switch and drivers mounted thereon;

a second substrate disposed in facing relation to said first substrate;

a material layer held between said first substrate and said second substrate and having peripheral edges sealed by a seal member, said material layer having an electrooptical effect;

a semiconductor chip mounted as a chip on glass (COG) component on said first substrate, said semiconductor chip having a control system configured to control said drivers;

an organic light-emitting diode (OLED) backlight illuminating said first substrate from a rear side of said first substrate through a diffusion sheet; and

a protective fixing member disposed on said first substrate only about a periphery of the semiconductor chip in a uniform manner so that a top side and a bottom side of the protective fixing member are co-planar with a respective top side and a bottom side of the semiconductor chip, the protective fixing member serving to fix the first substrate to the semiconductor chip and seal about the periphery of the semiconductor chip;

wherein,

said semiconductor chip has a thickness greater than a thickness of the seal member, and the thickness of the semiconductor chip is equal to or less than a total thickness of said seal member and said second substrate,

each of said semiconductor chip and said second substrate includes a polished surface.

2. The display device according to claim 1, wherein the protective fixing member is at least in part between the semiconductor chip and the seal member, the protective fixing member secures the semiconductor chip to the first substrate, prevents moisture and mobile ions from entering the semiconductor chip, and prevents horizontal and vertical displacement of the semiconductor chip.

10. The display device according to claim 1, further comprising:

a polarizing plate and phase difference plate combination disposed on said second substrate remotely from said material layer, wherein said thickness and said total thickness are 60 μ

m.

11. The display device according to claim 1, wherein an outer surface of the OLED backlight is covered by a protective film.

13. The display device according to claim 1, wherein said protective fixing member is disposed around the semiconductor chip including between the semiconductor chip and a combination of said second substrate and said seal member, wherein the protective fixing member is selected from the group consisting of:

silicon resin, polyimide resin, and ultraviolet curable resin.

3. A display device comprising:

a first substrate with a pixel switch and drivers mounted thereon;

a second substrate disposed in facing relation to said first substrate;

a material layer held between said first substrate and said second substrate and having peripheral edges sealed by a seal member, said material layer having an electrooptical effect;

a semiconductor chip mounted as a chip on glass (COG) component on said first substrate, said semiconductor chip having a control system configured to control said drivers;

a protective fixing member disposed on at least a portion of said first substrate only laterally of said semiconductor chip in a uniform manner so that a top side and a bottom side of the protective fixing member are co-planar with a respective top side and a bottom side of the semiconductor chip, the protective fixing member serving to fix the first substrate to the semiconductor chip and seal about a periphery of the semiconductor chip;

an organic light-emitting diode (OLED) backlight illuminating said first substrate from a rear side of said first substrate through a diffusion sheet,

wherein,

said semiconductor chip has a thickness equal to or smaller than the distance from a surface of said first substrate which faces said material layer to a surface of said second substrate which faces away from said material layer, and

each of said semiconductor chip and said second substrate includes a polished surface.

12. The display device according to claim 3, wherein an outer surface of the OLED backlight is covered by a protective film.

14. The display device according to claim 3, wherein the thickness of said semiconductor chip is greater than a thickness of said seal member, and said protective fixing member is disposed around the semiconductor chip including between the semiconductor chip and a combination of said second substrate and said seal member, wherein the protective fixing member is selected from the group consisting of:

silicon resin, polyimide resin, and ultraviolet curable resin.

4. A display device comprising:

a first substrate with a pixel switch and drivers mounted thereon;

a second substrate disposed in facing relation to said first substrate;

a material layer held between said first substrate and said second substrate and having peripheral edges sealed by a seal member, said material layer having an electrooptical effect;

a polarizing plate and phase difference plate combination disposed on said second substrate remotely from said material layer;

a semiconductor chip mounted as a chip on glass (COG) component on said first substrate, said semiconductor chip having a control system configured to control said drivers;

a protective fixing member disposed only around a periphery of the COG component in a uniform manner between the COG component and the seal member on the first substrate so that a top side and a bottom side of the protective fixing member are co-planar with a respective top side and a bottom side of the COG component, the protective fixing member serving to fix the first substrate to the COG component and seal the periphery of the semiconductor chip; and

an organic light-emitting diode (OLED) backlight illuminating said first substrate from a rear side of said first substrate through a diffusion sheet,

wherein,

said semiconductor chip has a thickness smaller than the total thickness of said seal member, said second substrate, and said polarizing plate and phase difference plate combination, and

at least said semiconductor chip includes a polished surface.

5. The display device according to claim 4, wherein said semiconductor chip has a thickness equal to or smaller than at least the total thickness of said seal member and said second substrate and the thickness of said semiconductor chip is greater than a thickness of said seal member.

6. The display device according to claim 4, wherein the protective fixing member prevents the COG component from being displaced horizontally or vertically.

7. The display device according to claim 5, wherein the protective fixing member prevents moisture and mobile ions from entering the COG component.

15. The display device according to claim 4, wherein he protective fixing member is selected from the group consisting of:

silicon resin, polyimide resin, and ultraviolet curable resin.

18. The display device according to claim 4, wherein said thickness and said total thickness are either 60 or 80 μ

m.

8. The electronic apparatus having a display device, said display device comprising:

a first substrate with a pixel switch and drivers mounted thereon;

a second substrate disposed in facing relation to said first substrate;

a material layer held between said first substrate and said second substrate and having peripheral edges sealed by a seal member, said material layer having an electrooptical effect;

a semiconductor chip mounted as a chip on glass (COG) component on said first substrate, said semiconductor chip having a control system configured to control said drivers;

a protective fixing member disposed on said first substrate only laterally around the semiconductor chip in a uniform manner so that a top side and a bottom side of the protective fixing member are co-planar with a respective top side and a bottom side of the semiconductor chip, the protective fixing member serving to fix the semiconductor chip to the first substrate and provide a seal about a periphery of the semiconductor chip; and

an organic light-emitting diode (OLED) backlight illuminating said first substrate from a rear side of said first substrate through a diffusion sheet; and

wherein,

said semiconductor chip has a thickness greater than a thickness of the seal member, and the thickness of the semiconductor chip is equal to or less than a total thickness of said seal member and said second substrate; and

each of said semiconductor chip and said second substrate includes a polished surface.

16. The display device according to claim 8, wherein protective fixing member is disposed only around the semiconductor chip including between the semiconductor chip and a combination of said second substrate and said seal member, wherein the protective fixing member is selected from the group consisting of:

silicon resin, polyimide resin, and ultraviolet curable resin.

9. The electronic apparatus having a display device, said display device comprising:

a first substrate with a pixel switch and drivers mounted thereon;

a second substrate disposed in facing relation to said first substrate;

a material layer held between said first substrate and said second substrate and having peripheral edges sealed by a seal member, said material layer having an electrooptical effect;

a polarizing plate and phase difference plate combination disposed on said second substrate remotely from said material layer;

a semiconductor chip mounted as a chip on glass (COG) component on said first substrate, said semiconductor chip having a control system configured to control said drivers;

a protective fixing member disposed only laterally around the COG component in a uniform manner between the COG component and the seal member on the first substrate so that a top side and a bottom side of the protective fixing member are co-planar with a respective top side and a bottom side of the COG component, the protective fixing member serving to fix the first substrate to the semiconductor chip and seal about a periphery of the semiconductor chip; and

an organic light-emitting diode (OLED) backlight illuminating said first substrate from a rear side of said first substrate through a diffusion sheet,

wherein,

said semiconductor chip has a thickness smaller than the total thickness of said seal member, said second substrate, and said polarizing plate and phase difference plate combination, and

at least said semiconductor chip includes a polished surface.

17. The display device according to claim 9, wherein the protective fixing member is selected from the group consisting of:

silicon resin, polyimide resin, and ultraviolet curable resin.