Method of inspecting a semiconductor device and an apparatus thereof
First Claim
1. A method of determining inspection conditions for inspecting a sample, comprising the steps of:
- inspecting a sample under plural inspection conditions;
storing inspection results including defect candidate position information on the sample;
determining at least one defect on the sample to be reviewed in detail from inspection results including defect candidate position information;
analyzing the at least one defect candidate on the sample; and
determining an inspection condition from the plural inspection conditions by using a result of the analyzing step.
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Abstract
A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.
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Citations
14 Claims
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1. A method of determining inspection conditions for inspecting a sample, comprising the steps of:
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inspecting a sample under plural inspection conditions; storing inspection results including defect candidate position information on the sample; determining at least one defect on the sample to be reviewed in detail from inspection results including defect candidate position information; analyzing the at least one defect candidate on the sample; and determining an inspection condition from the plural inspection conditions by using a result of the analyzing step. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of inspecting a sample, comprising the steps of:
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storing position data of defect candidates detected under plural inspection conditions; comparing the position data of each of the defect candidates; determining at least one defect on the sample to be reviewed in detail from the defect candidates position information calculated from the position data; analyzing the determined at least one defect on the sample; and determining an inspection condition of the sample by using information obtained from an image of the position on the sample determined to be reviewed. - View Dependent Claims (9, 10)
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11. An apparatus for inspecting a sample, comprising:
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an inspection condition setting means which sets an inspection condition of inspecting a sample; a storing means which stores position data of defect candidates on a sample, the position data being obtained by an inspection apparatus by sequentially inspecting the sample under plural inspection conditions set by the inspection condition setting means; determining means which determines at least one defect on the sample to be reviewed in detail from the position data of defect candidates; analyzing means which analyzes the determined at least one defect on the sample; and an inspection condition determining means which determines the inspection condition of the sample by using information of an image of the defect candidates, the identity of the defect candidates being checked, and inputs the determined inspection condition to the inspection condition setting means. - View Dependent Claims (12, 13, 14)
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Specification