Surface micromachined differential microphone

• US 8,276,254 B2
• Filed: 01/25/2007
• Issued: 10/02/2012
• Est. Priority Date: 01/31/2006
• Status: Expired due to Fees

• Current Assignee: The Research Foundation for The State University of New York (State University of New York)
• Original Assignee: The Research Foundation for The State University of New York (State University of New York)
• Inventors: Miles, Ronald N.
• Primary Examiner(s): Chambliss, Alonzo
• Application Number:
  US12/162,992
• Publication Number:
  US 20090046883A1
• Time in Patent Office: 2,077 Days
• Field of Search: None
• US Class Current: 29/594
• CPC Class Codes: H04R 1/38 in which sound waves act upon both sides of a diaphragm and incorporating acoustic phase-shifting means, e.g. pressure-gradient microphone
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182
• CPC Class Codes: Y10T 29/43 Electric condenser making
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/4908 Acoustic transducer

Abstract

A method of forming a miniature, surface micromachined, differential microphone, comprising depositing a sacrificial layer on a surface of a silicon wafer; depositing a diaphragm material on a surface of the sacrificial layer; etching the diaphragm material layer to isolate a diaphragm; and removing a portion of the sacrificial layer beneath the defined diaphragm. A diaphragm formed in the diaphragm material layer is supported by a hinge and otherwise isolated from a remaining portion of the diaphragm material layer by a slit adjacent a perimeter of the diaphragm. An enclosed back volume beneath the diaphragm has a depth defined by a thickness of the sacrificial layer, and communicates with an external region via the slit. A transducer may be provided for producing an electrical signal responsive to a displacement of the diaphragm.

Claims

1. A method of forming a miniature, surface micromachined, differential microphone, the steps comprising:

a) depositing a sacrificial layer on a top surface of a silicon wafer;

b) depositing a diaphragm material on an upper surface of said sacrificial layer;

c) etching said diaphragm material layer to isolate a diaphragm therein; and

d) removing at least a portion of said sacrificial layer from a region beneath said defined diaphragm, further comprising at least one of;

forming comb sense fingers along at least a portion of a perimeter of said diaphragm as a sub-step of etching step (c); and

forming a conductive layer intermediate said top surface of said silicon wafer and said sacrificial layer.

2. The method as recited in claim 1, wherein said etching step (c) further comprises the sub-step of forming comb sense fingers along at least a portion of a perimeter of said diaphragm.

3. The method as recited in claim 1, the steps comprising:

e) forming a conductive layer intermediate said top surface of said silicon wafer and said sacrificial layer.

4. The method as recited in claim 1, wherein said depositing step (a) comprises depositing a layer of at least one material from the group:

silicon dioxide, low temperature oxide (LTO), phosphosilicate glass (PSG), aluminum, photoresist material, a polymeric material.

5. The method as recited in claim 1, wherein said depositing step (b) comprises depositing a layer of at least one material from the group:

polysilicon, silicon nitride, gold, aluminum, and copper.

6. A miniature, surface micromachined, differential microphone, comprising:

a) a silicon substrate;

b) a sacrificial layer deposited upon an upper surface of said silicon substrate;

c) a diaphragm material layer deposited on an upper surface of said sacrificial layer;

d) a diaphragm and supporting hinge formed from said diaphragm material layer, said diaphragm being isolated from a surrounding portion of said diaphragm material layer except at said hinge by a slit formed in the diaphragm material layer adjacent a perimeter of said diaphragm;

e) an enclosed back volume beneath said diaphragm having a depth defined by a thickness of said sacrificial layer, said back volume communicating with a region external thereto only via said slit; and

at least one of;

a plurality of comb sense fingers disposed along at least a portion of a perimeter of said diaphragm, and a conductive layer intermediate said upper surface of said silicon substrate and said upper surface of said sacrificial layer.

7. The miniature, surface micromachined, differential microphone as recited in claim 6, further comprising:

f) a plurality of comb sense fingers disposed along at least a portion of a perimeter of said diaphragm.

8. The miniature, surface micromachined, differential microphone as recited in claim 6, further comprising:

f) a conductive layer intermediate said upper surface of said silicon substrate and said upper surface of said sacrificial layer.

9. The miniature, surface micromachined, differential microphone as recited in claim 6, wherein said sacrificial layer comprises at least one material from the group:

silicon dioxide, low temperature oxide (LTO), phosphosilicate glass (PSG), aluminum, photoresist material, a polymeric material.

10. The miniature, surface micromachined, differential microphone as recited in claim 6, wherein said diaphragm material layer comprises at least one material from the group:

polysilicon, silicon nitride, gold, aluminum, and copper.

11. In a miniature, surface micromachined, differential microphone, comprising a diaphragm having a perimeter and a plurality of comb sense fingers disposed along at least a portion of the perimeter formed from a diaphragm material layer and a supporting hinge formed from the diaphragm material layer, and an enclosed back volume beneath said diaphragm and having a side surface and a bottom surface and having a hole in one of said side and said bottom surfaces allowing communication between the back volume and a region external thereto, the improvement comprising:

a) a slit disposed between the perimeter of said diaphragm and a surrounding portion of said diaphragm material layer from which said diaphragm is isolated; and

b) the enclosed back volume beneath said diaphragm and having the side surface and the bottom surface, each of the side and said bottom surfaces being isolated from a region external to the enclosed back volume except via said slit.

12. A microphone, comprising:

a substrate, having deposited on a surface thereof a sacrificial layer, and a diaphragm layer disposed on top of said sacrificial layer, an aperture being formed through said diaphragm layer, and at least a portion of said sacrificial layer beneath the diaphragm layer being removed, resulting in a diaphragm with a void between said diaphragm layer and said substrate, wherein said diaphragm has an axis of rotational movement in response to acoustic waves which is substantially parallel to a plane of said diaphragm;

a transducer for producing an electrical signal responsive to a displacement of said diaphragm with respect to said substrate due to acoustic waves, comprising at least one of;

a plurality of comb sense fingers disposed along at least a portion of a perimeter of said diaphragm, and a conductive layer intermediate said substrate and said sacrificial layer.

13. The microphone according to claim 12, wherein said axis is located such that respective portions of said diaphragm on either side of the axis of rotational movement reciprocally rotate, in response to an acoustic wave.

14. The microphone according to claim 13, wherein a volume behind said diaphragm is substantially constant with respect to movements in response to acoustic waves.

15. The microphone according to claim 12, wherein a void space behind said diaphragm has a depth approximately the same as a depth of said sacrificial layer.

16. The microphone according to claim 12, wherein said diaphragm has respectively differentially responsive regions, further comprising at least one acoustic barrier to isolate the respectively differentially responsive regions from different portions of an incident acoustic wave.

17. The microphone according to claim 12, wherein said aperture comprises a slit permitting air flow therethrough.

18. The microphone according to claim 17, wherein a moment M acting on one side of said diaphragm with respect to said axis, in response to acoustic waves of amplitude P and frequency ω

, having a wavelength larger than a maximum linear dimension of said void, said diaphragm having dimensions L_y along said axis and L_x perpendicular to, and measured from said axis, said acoustic waves deflecting said diaphragm over small angles, is approximately;

19. The microphone according to claim 12, wherein said transducer has a first order directional response to acoustic waves.

20. The microphone according to claim 12, wherein said axis is located such respective portions of said diaphragm on either side of the axis of rotational movement reciprocally rotate, and wherein a void volume behind said diaphragm is substantially constant with respect to movements in response to acoustic waves, said aperture comprising a slit permitting air flow therethrough, and a moment M acting on one side of said diaphragm with respect to said axis, in response to acoustic waves of amplitude P and having a wavelength larger than a maximum linear dimension of said void and frequency ω

, said diaphragm having dimensions L_y along said axis and L_x perpendicular to, and measured from said axis, said acoustic waves deflecting said diaphragm over small angles, is approximately;