Apparatus for electrochemical plating semiconductor wafers
First Claim
Patent Images
1. An electroplating apparatus for depositing a conductive material on a semiconductor wafer, comprising:
- a vessel for holding an electroplating bath;
a support for holding a semiconductor wafer within the vessel and beneath a surface of the bath;
first and second electrodes within the vessel, between which an electrical current may flow causing conductive material to be electrolytically deposited onto the wafer;
a third electrode disposed outside of the bath for applying a static electric charge to the wafer; and
an electrical power supply coupled with the third electrode.
0 Assignments
0 Petitions
Accused Products
Abstract
An electroplating apparatus for depositing a conductive material on a semiconductor wafer includes a vessel for holding an electroplating bath, a support for holding a semiconductor wafer within the vessel and beneath a surface of the bath; first and second electrodes within the vessel, between which an electrical current may flow causing conductive material to be electrolytically deposited onto the wafer, a third electrode disposed outside of the bath for applying a static electric charge to the wafer, and an electrical power supply coupled with the third electrode.
16 Citations
20 Claims
-
1. An electroplating apparatus for depositing a conductive material on a semiconductor wafer, comprising:
-
a vessel for holding an electroplating bath; a support for holding a semiconductor wafer within the vessel and beneath a surface of the bath; first and second electrodes within the vessel, between which an electrical current may flow causing conductive material to be electrolytically deposited onto the wafer; a third electrode disposed outside of the bath for applying a static electric charge to the wafer; and an electrical power supply coupled with the third electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. An system for electroplating a semiconductor wafer, the apparatus comprising:
-
a tank with a bath of aqueous solution; a support holding the wafer in the bath; an anode disposed within the bath; an electrode outside of the tank in proximity to the bath; and a power supply in electrical communication with the wafer in the bath and with the electrode outside of the tank, the power supply applying a static charge to the wafer. - View Dependent Claims (11, 12, 13, 14, 15)
-
-
16. A system for depositing a conductive material on a substrate, comprising:
-
means for immersing the substrate in a solution including the conductive material and a plating accelerator; means for passing an electrical current through the solution and the wafer after immersing; and means for applying a static electric charge to the substrate prior to immersing in the solution, in which the means for applying a static charge include a power supply in electrical communication in an open circuit with the substrate and an electrode placed outside of the solution. - View Dependent Claims (17, 18, 19, 20)
-
Specification