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Apparatus for electrochemical plating semiconductor wafers

  • US 8,277,619 B2
  • Filed: 07/06/2011
  • Issued: 10/02/2012
  • Est. Priority Date: 01/25/2005
  • Status: Active Grant
First Claim
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1. An electroplating apparatus for depositing a conductive material on a semiconductor wafer, comprising:

  • a vessel for holding an electroplating bath;

    a support for holding a semiconductor wafer within the vessel and beneath a surface of the bath;

    first and second electrodes within the vessel, between which an electrical current may flow causing conductive material to be electrolytically deposited onto the wafer;

    a third electrode disposed outside of the bath for applying a static electric charge to the wafer; and

    an electrical power supply coupled with the third electrode.

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