Enhancement of optical polarization of nitride light-emitting diodes by wafer off-axis cut
First Claim
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1. A method of fabricating a light-emitting diode (LED), comprising:
- growing an LED structure on or above a surface of a nonpolar III-nitride substrate, wherein;
the surface is at an angle with respect to a nonpolar plane of the nonpolar III-nitride substrate,the angle is towards a polar (−
c or +c) orientation, andthe surface obtains a pre-determined polarization ratio of light emitted by the LED structure.
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Abstract
An off-axis cut of a nonpolar III-nitride wafer towards a polar (−c) orientation results in higher polarization ratios for light emission than wafers without such off-axis cuts. A 5° angle for an off-axis cut has been confirmed to provide the highest polarization ratio (0.9) than any other examined angles for off-axis cuts between 0° and 27°.
62 Citations
26 Claims
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1. A method of fabricating a light-emitting diode (LED), comprising:
growing an LED structure on or above a surface of a nonpolar III-nitride substrate, wherein; the surface is at an angle with respect to a nonpolar plane of the nonpolar III-nitride substrate, the angle is towards a polar (−
c or +c) orientation, andthe surface obtains a pre-determined polarization ratio of light emitted by the LED structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method of fabricating a light-emitting diode (LED), comprising:
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providing or obtaining a surface of a III-nitride substrate, or miscutting the III-nitride substrate to form the surface, wherein; the surface is at an angle with respect to a nonpolar plane of the III-nitride substrate, and the angle is towards a polar (−
c or +c) orientation, andgrowing an LED structure on or above the surface of a III-nitride substrate, wherein the angle is selected to control a polarization ratio of light emitted by the LED structure. - View Dependent Claims (25, 26)
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Specification