Semiconductor device and method for manufacturing the same
First Claim
1. A semiconductor device comprising:
- a semiconductor film over a substrate, wherein the semiconductor film includes a pair of P-type impurity regions and a pair of N-type impurity regions;
a first gate electrode and a second gate electrode adjacent to the semiconductor film with a gate insulating film interposed therebetween; and
an electrode in direct contact with one of the pair of P-type impurity regions and one of the pair of N-type impurity regions,wherein the one of the pair of P-type impurity regions is in direct contact with the one of the pair of N-type impurity regions.
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Abstract
A method for manufacturing a semiconductor device such as a thin film transistor using a crystal silicon film is provided. The crystal silicon film is obtained by selectively forming films, particles or clusters containing nickel, iron, cobalt, ruthenium, rhodium, paradium, osmium, iridium, platinum, scandium, titanium, vanadium, chrome, manganese, copper, zinc, gold, silver or silicide thereof in a form of island, line, stripe, dot or film on or under an amorphous silicon film and using them as a starting point, by advancing its crystallization by annealing at a temperature lower than a normal crystallization temperature of an amorphous silicon. A transistor having low leak current and high mobility are obtained in the same time in a dynamic circuit having a thin film transistor by selectively forming a cover film on a semiconductor layer which is to become an active layer of the transistor and by thermally crystallizing it thereafter.
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Citations
15 Claims
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1. A semiconductor device comprising:
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a semiconductor film over a substrate, wherein the semiconductor film includes a pair of P-type impurity regions and a pair of N-type impurity regions; a first gate electrode and a second gate electrode adjacent to the semiconductor film with a gate insulating film interposed therebetween; and an electrode in direct contact with one of the pair of P-type impurity regions and one of the pair of N-type impurity regions, wherein the one of the pair of P-type impurity regions is in direct contact with the one of the pair of N-type impurity regions. - View Dependent Claims (2, 3, 4, 5)
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6. A semiconductor device comprising:
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a semiconductor film over a substrate, wherein the semiconductor film includes a pair of P-type impurity regions and a pair of N-type impurity regions; a first gate electrode and a second gate electrode over the semiconductor film with a gate insulating film interposed therebetween; an interlayer insulator over the first gate electrode and the second gate electrode; and an electrode over the interlayer insulator, wherein the electrode is in direct contact with one of the pair of P-type impurity regions and one of the pair of N-type impurity regions, and wherein the one of the pair of P-type impurity regions is in direct contact with the one of the pair of N-type impurity regions. - View Dependent Claims (7, 8, 9, 10)
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11. A semiconductor device comprising:
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a semiconductor film over a substrate, wherein the semiconductor film includes a pair of P-type impurity regions and a pair of N-type impurity regions; a first gate electrode and a second gate electrode over the semiconductor film with a gate insulating film interposed therebetween; an interlayer insulator over the first gate electrode and the second gate electrode; and a first electrode, a second electrode, and a third electrode over the interlayer insulator, wherein the first electrode is in direct contact with one of the pair of P-type impurity regions and one of the pair of N-type impurity regions, wherein the second electrode is in direct contact with the other one of the pair of P-type impurity regions, and the third electrode is in direct contact with the other one of the pair of N-type impurity regions, and wherein the one of the pair of P-type impurity regions is in direct contact with the one of the pair of N-type impurity regions. - View Dependent Claims (12, 13, 14, 15)
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Specification