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Semiconductor test system and method

  • US 8,278,958 B2
  • Filed: 05/01/2009
  • Issued: 10/02/2012
  • Est. Priority Date: 05/01/2009
  • Status: Active Grant
First Claim
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1. A method of testing a plurality of semiconductor devices on a wafer using a single piece of automated testing equipment, each device having the same plurality of electrical connections, each semiconductor device comprising a first subset and a second subset of electrical connections, wherein the first subset and the second subset of electrical connections are different, and wherein the first subset of each device and the second subset of each device are the same for each device, the method comprising the steps of:

  • (a) using a probe card to make a first set of electrical connections from the automated test equipment to the first subset of the electrical connections of a first set of the plurality of devices to allow a first set of tests to be performed on the first set of devices and concurrently making a second set of electrical connections from the automated test equipment to the second subset of the electrical connections of a second set of the plurality of devices to allow a second set of tests to be performed on the second set of devices, wherein the first and second sets of tests are different;

    (b) concurrently performing the first set of tests on the first set of devices and the second set of tests on the second set of devices using the automated test equipment;

    (c) relocating the probe card to make the first set of electrical connections from the automated test equipment to the first subset of electrical connections of a first further set of the plurality of devices to allow a first set of tests to be performed on the first further set of devices and concurrently making the second set of electrical connections from the automated test equipment to the second subset of the electrical connections of a second further set of devices to allow the second set of tests to be performed on the second further set of devices; and

    (d) concurrently performing the first set of tests on the first further set of devices and the second set of tests on the second further set of devices using the automated test equipment.

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