AC — LED system in single chip with three metal contacts

• US 8,279,621 B2
• Filed: 04/08/2011
• Issued: 10/02/2012
• Est. Priority Date: 12/09/2005
• Status: Active Grant

• Current Assignee: Epistar Corporation
• Original Assignee: Epistart Corporation
• Inventors: Lin, Ming-Te, Yeh, Wen-Yung, Kuo, Chia-Chang, Yen, Hsi-Hsuan, Huang, Sheng-Pan
• Primary Examiner(s): NGUYEN, HOA CAO
• Application Number:
  US13/083,142
• Publication Number:
  US 20110186881A1
• Time in Patent Office: 543 Days
• Field of Search: 361/760, 361/761, 361/767, 361/768, 361/777, 361/781, 361/806, 361/805, 361807-810, 362/249.01, 362/249.02, 362/249.06, 362/249.11, 362/249.13, 362/249.14, 362/249.15, 362/226, 362/227, 362/262, 362/238, 362/800, 315184-185 R, 257 88- 99, 257/82, 257/164
• US Class Current: 361/806
• CPC Class Codes: H05B 45/00 Circuit arrangements for operating light-emitting diodes [LED]
• CPC Class Codes: H05B 45/42 Antiparallel configurations

Abstract

A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip. Alternatively, an AC LED system in single chip with four metal contacts is also disclosed.

Claims

1. An LED system in a single chip, comprising:

a plurality of LED units on a substrate;

first, second, third, and fourth metal contacts disposed on the substrate;

a first series of LED units having a first end coupled to the first metal contact and a second end coupled to the fourth metal contact;

a second series of LED units having a first end coupled to the second metal contact and a second end coupled to the fourth metal contact; and

a third series of LED units having a first end coupled to the third metal terminal and a second end coupled to the fourth metal contact.

2. An LED system in a single chip as claimed in claim 1, wherein each of the metal contacts is a metal pad.

3. An LED system in a single chip as claimed in claim 1, wherein the first, second, third, and fourth metal contacts are metal pads.

4. An LED system in a single chip as claimed in claim 1, wherein the LED units are disposed with area division between the metal contacts.

5. An LED system in a single chip as claimed in claim 1, wherein at least three of the metal contacts are disposed at the corners of the single chip.

6. An LED system in a single chip as claimed in claim 1, wherein the metal contacts are disposed at the borders of the single chip.