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Ultrasonic acoustic emissions to detect substrate fracture

  • US 8,281,661 B2
  • Filed: 05/27/2010
  • Issued: 10/09/2012
  • Est. Priority Date: 05/27/2010
  • Status: Expired due to Fees
First Claim
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1. A method of detecting a fracture as it occurs in a component during a manufacturing process, the method comprising:

  • positioning an acoustic sensor in acoustic communication with the component;

    performing a manufacturing process while the acoustic sensor remains in acoustic communication with the component;

    providing a signal indicative of acoustic emissions from the component during the manufacturing process to a controller; and

    determining whether the component has fractured by comparing the magnitude of the signal to a predetermined maximum.

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