Method for manufacture of transparent devices having light emitting diodes (LED)
First Claim
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1. A transparent LED display, comprising:
- a series of conductive paths on a transparent underlayer;
said conductive paths connected to electronic control means;
said transparent underlayer associated to an array of LED sources addressable individually or in groups through said conductive paths;
said LED sources integrated in the form of chips, said chips comprising elements obtained by dividing up a semiconductor wafer and without package, on said transparent underlayer of a chip-on-board type; and
said chip electrically connected to said underlayer using a flip-chip technique for die bonding.
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Abstract
A method of fabrication of transparent LED devices, of the type comprising the operations of: i) providing a series of conductive paths on a transparent underlayer; ii) connecting said conductive paths to electronic control means; iii) associating to said underlayer an array of LED sources addressable individually or in groups through said conductive paths, in which i) said LED sources are integrated in the form of chips, i.e., of elements obtained by dividing up a semiconductor wafer and without package, via technologies of the chip-on-board type; ii) said method envisages the use of the flip-chip technique for die bonding, i.e., the electrical connection of the chip to the underlayer.
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12 Claims
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1. A transparent LED display, comprising:
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a series of conductive paths on a transparent underlayer; said conductive paths connected to electronic control means; said transparent underlayer associated to an array of LED sources addressable individually or in groups through said conductive paths; said LED sources integrated in the form of chips, said chips comprising elements obtained by dividing up a semiconductor wafer and without package, on said transparent underlayer of a chip-on-board type; and said chip electrically connected to said underlayer using a flip-chip technique for die bonding. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification