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Method for manufacture of transparent devices having light emitting diodes (LED)

  • US 8,283,680 B2
  • Filed: 04/05/2006
  • Issued: 10/09/2012
  • Est. Priority Date: 04/21/2005
  • Status: Expired due to Fees
First Claim
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1. A transparent LED display, comprising:

  • a series of conductive paths on a transparent underlayer;

    said conductive paths connected to electronic control means;

    said transparent underlayer associated to an array of LED sources addressable individually or in groups through said conductive paths;

    said LED sources integrated in the form of chips, said chips comprising elements obtained by dividing up a semiconductor wafer and without package, on said transparent underlayer of a chip-on-board type; and

    said chip electrically connected to said underlayer using a flip-chip technique for die bonding.

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