MEMS package and method of manufacturing the MEMS package

• US 8,283,737 B2
• Filed: 09/11/2009
• Issued: 10/09/2012
• Est. Priority Date: 11/21/2008
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Sugizaki, Yoshiaki
• Primary Examiner(s): Wilson, Allan R
• Application Number:
  US12/558,171
• Publication Number:
  US 20100127340A1
• Time in Patent Office: 1,124 Days
• Field of Search: 257/415, 257/773, 257/778, 257/E21.499, 257/E23.06, 257/E29.324, 438/51
• US Class Current: 257/415
• CPC Class Codes: B81B 2207/092 Buried interconnects in the substrate or in the lid
• CPC Class Codes: B81B 2207/096 through the substrate
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/11 Manufacturing methods
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 2224/73259 Bump and HDI connectors
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

An MEMS chip is mounted face-down on a semiconductor wafer such that a movable section is opposed to the semiconductor wafer. A resin layer is formed on the semiconductor wafer around the MEMS chip to reduce a step between the MEMS chip and the semiconductor wafer. After the semiconductor substrate is removed, the land electrode is formed on the resin layer.

Claims

1. An MEMS package, comprising:

a semiconductor chip on which a semiconductor element and a first pad electrode are formed;

a movable section formed above an insulating layer;

a first resin layer formed on the insulating layer so as to seal the movable section;

first and second electrodes electrically connected to the movable section formed above the insulating layer;

a first protruding electrode formed on the first electrode, the first protruding electrode connecting the first pad electrode and the first electrode; and

a first land electrode connected to a rear surface of the second electrode via a first opening formed in the insulating layer.

2. The MEMS package according to claim 1, further comprising:

a second pad electrode formed on the semiconductor chip; and

a second land electrode formed on the first resin layer and connected to the second pad electrode via a through hole pierced through the first resin layer.

3. The MEMS package according to claim 1, further comprising a conductor bump embedded in the through hole.

4. The MEMS package according to claim 2, further comprising:

a second protruding electrode formed on the first land electrode; and

a third protruding electrode formed on the second land electrode.

5. The MEMS package according to claim 2, further comprising:

a first metal pillar formed on the first land electrode;

a second metal pillar formed on the second land electrode;

a second resin layer formed on the first land electrode and the second land electrode to cover peripheries of the first metal pillar and the second metal pillar such that upper edges of the first metal pillar and the second metal pillar are exposed;

a second protruding electrode formed on the first metal pillar; and

a third protruding electrode formed on the second metal pillar.

6. The MEMS package according to claim 1,

wherein the first resin layer is filled between the insulating layer and the semiconductor chip around the movable section.

7. The MEMS package according to claim 6,

wherein the first protruding electrode is buried in the first resin layer.

8. The MEMS package according to claim 7, further comprising:

a cap layer formed on the insulating layer so as to separate the movable section from the first resin layer, the cap layer being provided on the inner surface of the first resin layer over the movable section.

9. The MEMS package according to claim 8, wherein the insulating layer is wholly buried in the first resin layer with the movable section.