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Electronics package suitable for implantation

  • US 8,285,380 B2
  • Filed: 03/23/2012
  • Issued: 10/09/2012
  • Est. Priority Date: 04/11/2002
  • Status: Expired due to Fees
First Claim
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1. An implantable device comprising:

  • a first substrate forming part of a rigid hermetic package, containing a first electrically conductive pad on a first side of said first substrate electrically connected to hermetic vias through the first substrate;

    a first flexible electrically insulating layer on said first side of said substrate;

    a flexible electrically conducting layer on said first flexible electrically insulating layer wherein at least a portion of said flexible electrically conducting layer electrically contacts said first conductive pad;

    a second flexible electrically insulating layer on said flexible electrically conducting layer and said first flexible electrically insulating layer;

    a second substrate containing a second conductive pad on a first side of said second substrate,wherein the second conductive pad electrically contacts at least a portion of said flexible electrically conducting layer.

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