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Method and apparatus for minimizing contamination in semiconductor processing chamber

  • US 8,287,648 B2
  • Filed: 02/09/2009
  • Issued: 10/16/2012
  • Est. Priority Date: 02/09/2009
  • Status: Active Grant
First Claim
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1. A semiconductor processing apparatus comprising:

  • a cross-flow reaction chamber located above a loading chamber, separated by a baseplate including an opening;

    a movable workpiece support configured to hold a semiconductor workpiece;

    a drive mechanism configured to move the workpiece support between a loading position and a processing position;

    a reaction chamber inlet;

    a reaction chamber outlet, wherein the reaction gas inlet is located opposite to the reaction gas outlet, such that reaction gas that flows from the inlet to the outlet travels approximately parallel to a face of the workpiece;

    a loading chamber inlet;

    a loading chamber outlet; and

    a control system configured to control flow through the reaction chamber inlet and outlet and the loading chamber inlet and outlet such that the pressure of the reaction chamber is higher than that of the loading chamber while the workpiece support is moving, and lower than that of the loading chamber while the workpiece support is in the processing position.

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