×

Apparatus and method of wafer bonding using compatible alloy

  • US 8,288,191 B2
  • Filed: 04/08/2011
  • Issued: 10/16/2012
  • Est. Priority Date: 09/10/2008
  • Status: Active Grant
First Claim
Patent Images

1. A method of forming an inertial sensor, the method comprising:

  • providing a device wafer with a two-dimensional array of MEMS inertial sensors;

    providing a second wafer;

    depositing an alloy comprising aluminum/germanium onto one or both the device wafer and the second wafer;

    coupling the device wafer and the second wafer together after depositing the alloy onto the one or both wafers, the alloy being positioned between the two wafers;

    heating the alloy before, after, or substantially simultaneously with coupling the alloy;

    cooling the alloy after melting to form a plurality of conductive hermetic seal rings about the plurality of the inertial sensors, the seal rings bonding the device wafer to the second wafer; and

    dicing the wafers to form a plurality of individual, hermetically sealed inertial sensors.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×