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Flexible substrate with electronic devices and traces

  • US 8,288,214 B2
  • Filed: 05/12/2011
  • Issued: 10/16/2012
  • Est. Priority Date: 10/03/2006
  • Status: Expired due to Fees
First Claim
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1. A method of manufacturing an electronic device comprising:

  • a) providing a substrate that comprises at least one plastic material;

    b) forming a pattern on at least one surface of said substrate;

    c) embedding a non-doping particulate material at and below at least one surface of said substrate, wherein the embedded particles have high concentration at the surface and the concentration decreases with depth inside the substrate;

    d) applying a planarization material to the surface of the substrate having the embedded particulate material, forming a planarization layer thereby;

    e) forming a thin film electronic device on said surface with said particulate material; and

    f) forming a patterned trace layer on the surface of the substrate that lies opposite the surface having the embedded particulate material.

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