Flexible substrate with electronic devices and traces

• US 8,288,214 B2
• Filed: 05/12/2011
• Issued: 10/16/2012
• Est. Priority Date: 10/03/2006
• Status: Expired due to Fees

• Current Assignee: Eastman Kodak Company
• Original Assignee: Eastman Kodak Company
• Inventors: Tredwell, Timothy J., Kerr, Roger S.
• Primary Examiner(s): Brewster, William M.
• Application Number:
  US13/106,203
• Publication Number:
  US 20110212555A1
• Time in Patent Office: 523 Days
• Field of Search: 438/151, 438/667, 438/780, 257/E29.158
• US Class Current: 438/151
• CPC Class Codes: H01L 27/124 with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 29/78603 characterised by the insulating substrate or support H01L29/78657 takes precedence
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

A method of manufacturing an electronic device (10) provides a substrate (20) that has a plastic material and has a metallic coating on one surface. A portion of the metallic coating is etched to form a patterned metallic coating. A particulate material (16) is embedded in at least one surface of the substrate. A layer of thin-film semiconductor material is deposited onto the substrate (20).

Claims

1. A method of manufacturing an electronic device comprising:

a) providing a substrate that comprises at least one plastic material;

b) forming a pattern on at least one surface of said substrate;

c) embedding a non-doping particulate material at and below at least one surface of said substrate, wherein the embedded particles have high concentration at the surface and the concentration decreases with depth inside the substrate;

d) applying a planarization material to the surface of the substrate having the embedded particulate material, forming a planarization layer thereby;

e) forming a thin film electronic device on said surface with said particulate material; and

f) forming a patterned trace layer on the surface of the substrate that lies opposite the surface having the embedded particulate material.

2. The method of claim 1 wherein forming a pattern comprises embossing.

3. The method of claim 1 wherein the pattern comprises one or more lens elements.

4. The method of claim 1 wherein the one or more lens elements are spatially aligned with the thin film electronic devices formed on said surface.

5. The method of claim 1 wherein the step of providing the substrate comprises unwinding the substrate from a roll.

6. The method of claim 5 further comprising re-winding the substrate having the electronic device formed thereon onto a roll.

7. The method of claim 1 further comprising coupling the electronic device formed on said surface with a liquid crystal pixel.

8. The method of claim 1 further comprising coupling the electronic device formed on said surface with a light-emitting diode pixel.

9. The method of claim 1 further comprising coupling the electronic device formed on said surface with an organic light-emitting diode pixel.

10. The method of claim 1 further comprising coupling the electronic device formed on said surface with a stimulable phosphor pixel.

11. The method of claim 1 further comprising coupling the electronic device formed on said surface with a sensor pixel.