Semiconductor chip assembly with post/base/post heat spreader

• US 8,288,792 B2
• Filed: 01/10/2011
• Issued: 10/16/2012
• Est. Priority Date: 03/25/2008
• Status: Active Grant

• Current Assignee: Bridge Semiconductor Corporation
• Original Assignee: Bridge Semiconductor Corporation
• Inventors: Lin, Charles W. C., Wang, Chia-Chung
• Primary Examiner(s): Wagner, Jenny L
• Assistant Examiner(s): Boyle, Abbigale
• Application Number:
  US12/987,166
• Publication Number:
  US 20110101410A1
• Time in Patent Office: 645 Days
• Field of Search: 257/712, 257/99, 257/711, 257/717, 257/706, 257/707, 257/E23.102, 438/39, 438/121, 438/118, 438/464, 438/669, 438/670
• US Class Current: 257/99
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/32013 the layer connector being larger than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32188 the layer connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83855 Hardening the adhesive by curing, i.e. thermosetting
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 24/28 Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/642 : characterized by the shape
• CPC Class Codes: H05K 1/0204 : using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/056 : the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/09054 : Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2203/0369 : Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
• CPC Class Codes: H05K 2203/063 : of preperforated insulating layer
• CPC Class Codes: H05K 3/445 : having insulated holes or insulated via connections through the metal core

Abstract

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The heat spreader includes a first post, a second post and a base. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The first post extends from the base in a first vertical direction into a first opening in the first adhesive, the second post extends from the base in a second vertical direction into a second opening in the second adhesive and the base is sandwiched between and extends laterally from the posts. The conductive trace provides signal routing between the pad and the terminal.

Claims

1. A semiconductor chip assembly, comprising:

a semiconductor device;

a first adhesive that includes a first opening;

a second adhesive that includes a second opening;

a heat spreader that includes a first post, a second post and a base, wherein (i) the first post is adjacent to the base and extends vertically from the base in a first vertical direction, (ii) the second post is adjacent to the base and extends vertically from the base in a second vertical direction opposite the first vertical direction and (iii) the base is sandwiched between the posts and extends laterally from the posts in lateral directions orthogonal to the vertical directions; and

a conductive trace that includes a pad, a terminal and an electrical interconnect, wherein an electrically conductive path between the pad and the terminal includes the electrical interconnect;

wherein the semiconductor device is mounted on the first post, extends vertically beyond the base in the first vertical direction, extends laterally within peripheries of the posts, is electrically connected to the pad and thereby electrically connected to the terminal and is thermally connected to the first post and thereby thermally connected to the second post;

wherein the first adhesive extends vertically beyond the base in the first vertical direction, extends laterally from the first post to or beyond the terminal and is sandwiched between the base and the pad;

wherein the second adhesive extends vertically beyond the base in the second vertical direction, extends laterally from the second post to or beyond the terminal and is sandwiched between the base and the terminal;

wherein the pad extends vertically beyond the first post and the base in the first vertical direction, the terminal extends vertically beyond the second post and the base in the second vertical direction and the electrical interconnect extends through the adhesives and the base and is spaced from and electrically isolated from the base; and

wherein the first post extends into the first opening and extends vertically beyond a lateral surface of the pad in the first vertical direction, the second post extends into the second opening and extends vertically beyond a lateral surface of the terminal in the second vertical direction and the base is sandwiched between the adhesives and covers the semiconductor device in the second vertical direction.

2. The assembly of claim 1, wherein the semiconductor device is an LED chip.

3. The assembly of claim 1, wherein the semiconductor device is electrically connected to the pad using a wire bond and is thermally connected to the first post using a die attach.

4. The assembly of claim 1, wherein the semiconductor device is electrically connected to the pad using a first solder joint and is thermally connected to the first post using a second solder joint.

5. The assembly of claim 1, wherein the first adhesive contacts the first post and the base and is spaced from the second post and the second adhesive contacts the second post and the base and is spaced from the first post.

6. The assembly of claim 1, wherein the first adhesive covers and surrounds the first post in the lateral directions and the second adhesive covers and surrounds the second post in the lateral directions.

7. The assembly of claim 1, wherein the first adhesive extends to peripheral edges of the assembly and the second adhesive extends to peripheral edges of the assembly.

8. The assembly of claim 1, wherein the adhesives are spaced from one another.

9. The assembly of claim 1, wherein the first post is integral with the base and the second post is integral with the base.

10. The assembly of claim 1, wherein the first post has a diameter that decreases as it extends vertically from the base in the first vertical direction and the second post has a diameter that decreases as it extends vertically from the base in the second vertical direction.

11. The assembly of claim 1, wherein the base extends to peripheral edges of the assembly.

12. The assembly of claim 1, wherein the pad extends beyond the first adhesive in the first vertical direction and the terminal extends beyond the second adhesive in the second vertical direction.

13. The assembly of claim 1, wherein the pad contacts the first adhesive and the terminal contacts the second adhesive.

14. The assembly of claim 1, wherein the pad is spaced from the first adhesive, the terminal is spaced from the second adhesive, a first dielectric layer contacts and is sandwiched between the pad and the first adhesive and is spaced from the first post and the base, a second dielectric layer contacts and is sandwiched between the terminal and the second adhesive and is spaced from the second post and the base, the first post extends through the first dielectric layer, the second post extends through the second dielectric layer and the electrical interconnect extends through the dielectric layers.

15. The assembly of claim 1, wherein the electrical interconnect is a plated through-hole that extends through and is spaced from the adhesives and the base.

16. The assembly of claim 1, wherein the pad and the terminal are the same metals.

17. The assembly of claim 1, wherein the pad and the terminal include a gold, silver or nickel surface layer and a buried copper core and are primarily copper and the base is copper.

18. The assembly of claim 1, wherein the conductive trace includes a copper core shared by the pad, the terminal and the electrical interconnect.

19. The assembly of claim 1, wherein the heat spreader includes a copper core shared by the posts and the base.

20. The assembly of claim 1, wherein the conductive trace includes a copper core shared by the pad, the terminal and the electrical interconnect and the heat spreader includes a copper core shared by the posts and the base.

21. A semiconductor chip assembly, comprising:

a semiconductor device;

a first adhesive that includes a first opening;

a second adhesive that includes a second opening;

a heat spreader that includes a first post, a second post, a first cap, a second cap and a base, wherein (i) the first post is adjacent to and integral with the base, extends vertically from the base in a first vertical direction and is sandwiched between the base and the first cap, (ii) the second post is adjacent to and integral with the base, extends vertically from the base in a second vertical direction opposite the first vertical direction and is sandwiched between the base and the second cap, (iii) the base is sandwiched between the posts and extends laterally from the posts in lateral directions orthogonal to the vertical directions, (iv) the first cap is adjacent to the first post, covers the first post in the first vertical direction and extends laterally from the first post and (v) the second cap is adjacent to the second post, covers the second post in the second vertical direction and extends laterally from the second post; and

a conductive trace that includes a pad, a terminal and an electrical interconnect, wherein an electrically conductive path between the pad and the terminal includes the electrical interconnect;

wherein the semiconductor device is mounted on the first cap, extends vertically beyond the first cap in the first vertical direction, extends laterally within peripheries of the posts and the caps, is electrically connected to the pad and thereby electrically connected to the terminal and is thermally connected to the first cap and thereby thermally connected to the second cap;

wherein the first adhesive contacts the first post and the base, is spaced from the second post, extends vertically beyond the base in the first vertical direction, extends laterally from the first post to or beyond the terminal and is sandwiched between the base and the pad;

wherein the second adhesive contacts the second post and the base, is spaced from the first post, extends vertically beyond the base in the second vertical direction, extends laterally from the second post to or beyond the terminal and is sandwiched between the base and the terminal;

wherein the pad extends vertically beyond the first post and the first adhesive in the first vertical direction, the terminal extends vertically beyond the second post and the second adhesive in the second vertical direction and the electrical interconnect extends through the adhesives and the base and is spaced from and electrically isolated from the base; and

wherein the first post extends into the first opening and extends vertically beyond a lateral surface of the pad in the first vertical direction, the second post extends into the second opening and extends vertically beyond a lateral surface of the terminal in the second vertical direction, the first cap extends vertically beyond the first adhesive in the first vertical direction, the second cap extends vertically beyond the second adhesive in the second vertical direction and the base is sandwiched between the adhesives and covers the semiconductor device in the second vertical direction.

22. The assembly of claim 21, wherein the semiconductor device is an LED chip, is located within the peripheries of the posts and the caps, is mounted on the first cap using a die attach, is electrically connected to the pad using a wire bond and is thermally connected to the first cap using the die attach.

23. The assembly of claim 21, wherein the first adhesive contacts the first cap and the second adhesive contacts the second cap.

24. The assembly of claim 21, wherein the first adhesive covers and surrounds the first post in the lateral directions and the second adhesive covers and surrounds the second post in the lateral directions.

25. The assembly of claim 21, wherein the first adhesive extends to peripheral edges of the assembly and the second adhesive extends to peripheral edges of the assembly.

26. The assembly of claim 21, wherein the first post has a diameter that decreases as it extends vertically from the base to the first cap and the second post has a diameter that decreases as it extends vertically from the base to the second cap.

27. The assembly of claim 21, wherein the first post is coplanar with the first adhesive at the first cap and the second post is coplanar with the second adhesive at the second cap.

28. The assembly of claim 21, wherein the base extends to peripheral edges of the assembly.

29. The assembly of claim 21, wherein the pad contacts the first adhesive and the terminal contacts the second adhesive.

30. The assembly of claim 21, wherein the pad is spaced from the first adhesive, the terminal is spaced from the second adhesive, a first dielectric layer contacts and is sandwiched between the pad and the first adhesive and is spaced from the first post and the base, a second dielectric layer contacts and is sandwiched between the terminal and the second adhesive and is spaced from the second post and the base, the first post extends through the first dielectric layer, the second post extends through the second dielectric layer and the electrical interconnect extends through the dielectric layers.

31. The assembly of claim 21, wherein the electrical interconnect is a plated through-hole that extends through and is spaced from the adhesives and the base.

32. The assembly of claim 21, wherein the pad and the first cap have the same thickness where closest to one another and are coplanar with one another at a first surface that faces in the first vertical direction.

33. The assembly of claim 21, wherein the pad and the first cap have the same thickness where closest to one another, have different thickness where the first cap is adjacent to the first post and are coplanar with one another at a first surface that faces in the first vertical direction.

34. The assembly of claim 21, wherein the terminal and the second cap have the same thickness where closest to one another and are coplanar with one another at a second surface that faces in the second vertical direction.

35. The assembly of claim 21, wherein the terminal and the second cap have the same thickness where closest to one another, have different thickness where the second cap is adjacent to the second post and are coplanar with one another at a second surface that faces in the second vertical direction.

36. The assembly of claim 21, wherein the pad, the terminal and the caps are the same metals and the posts and the base are the same metal.

37. The assembly of claim 21, wherein the pad, the terminal and the caps include a gold, silver or nickel surface layer and a buried copper core and are primarily copper and the posts and the base are copper.

38. The assembly of claim 21, wherein the conductive trace includes a copper core shared by the pad, the terminal and the electrical interconnect.

39. The assembly of claim 21, wherein the heat spreader includes a copper core shared by the posts, the base and the caps.

40. The assembly of claim 21, wherein the conductive trace includes a copper core shared by the pad, the terminal and the electrical interconnect and the heat spreader includes a copper core shared by the posts, the base and the caps.

41. A semiconductor chip assembly, comprising:

a semiconductor device;

a first adhesive that includes a first opening;

a second adhesive that includes a second opening;

a heat spreader that includes a first post, a second post, a first cap, a second cap and a base, wherein (i) the first post is adjacent to and integral with the base, extends vertically from the base in a first vertical direction and is sandwiched between the base and the first cap, (ii) the second post is adjacent to and integral with the base, extends vertically from the base in a second vertical direction opposite the first vertical direction and is sandwiched between the base and the second cap, (iii) the base is sandwiched between the posts and extends laterally from the posts and laterally beyond the caps in lateral directions orthogonal to the vertical directions, (iv) the first cap is adjacent to the first post, covers the first post in the first vertical direction and extends laterally from the first post and (v) the second cap is adjacent to the second post, covers the second post in the second vertical direction and extends laterally from the second post; and

a conductive trace that includes a pad, a terminal and an electrical interconnect, wherein the electrical interconnect is a plated through-hole and an electrically conductive path between the pad and the terminal includes the electrical interconnect;

wherein the semiconductor device is mounted on the first cap, extends vertically beyond the first cap in the first vertical direction, extends laterally within peripheries of the posts and the caps, is electrically connected to the pad and thereby electrically connected to the terminal and is thermally connected to the first cap and thereby thermally connected to the second cap;

wherein the first adhesive contacts the first post and the base, is spaced from the second post, the second adhesive and the terminal, extends vertically beyond the base in the first vertical direction, extends laterally from the first post to or beyond the terminal and is sandwiched between the base and the pad;

wherein the second adhesive contacts the second post and the base, is spaced from the first post and the pad, extends vertically beyond the base in the second vertical direction, extends laterally from the second post to or beyond the terminal and is sandwiched between the base and the terminal;

wherein the pad extends vertically beyond the first post and the first adhesive in the first vertical direction, the terminal extends vertically beyond the second post and the second adhesive in the second vertical direction and the electrical interconnect extends through and is spaced from the adhesives and the base and is electrically isolated from the base; and

wherein the first post extends into the first opening and extends vertically beyond a lateral surface of the pad in the first vertical direction, the second post extends into the second opening and extends vertically beyond a lateral surface of the terminal in the second vertical direction, the first cap extends vertically beyond the first adhesive in the first vertical direction, the second cap extends vertically beyond the second adhesive in the second vertical direction and the base is sandwiched between the adhesives, covers the semiconductor device in the second vertical direction and extends to peripheral edges of the assembly.

42. The assembly of claim 41, wherein the semiconductor device is an LED chip, is located within the peripheries of the posts and the caps, is mounted on the first cap using a die attach, is electrically connected to the pad using a wire bond and is thermally connected to the first cap using the die attach.

43. The assembly of claim 41, wherein the first adhesive contacts the first cap, covers and surrounds the first post in the lateral directions and extends to peripheral edges of the assembly and the second adhesive contacts the second cap, covers and surrounds the second post in the lateral directions and extends to peripheral edges of the assembly.

44. The assembly of claim 41, wherein the first post has a diameter that decreases as it extends vertically from the base to the first cap and the second post has a diameter that decreases as it extends vertically from the base to the second cap.

45. The assembly of claim 41, wherein the first post is coplanar with the first adhesive at the first cap and the second post is coplanar with the second adhesive at the second cap.

46. The assembly of claim 41, wherein the pad contacts the first adhesive and the terminal contacts the second adhesive.

47. The assembly of claim 41, wherein the pad is spaced from the first adhesive, the terminal is spaced from the second adhesive, a first dielectric layer contacts and is sandwiched between the pad and the first adhesive and is spaced from the first post and the base, a second dielectric layer contacts and is sandwiched between the terminal and the second adhesive and is spaced from the second post and the base, the first post extends through the first dielectric layer, the second post extends through the second dielectric layer and the electrical interconnect extends through the dielectric layers.

48. The assembly of claim 41, wherein the pad and the first cap have the same thickness where closest to one another, have different thickness where the first cap is adjacent to the first post and are coplanar with one another at a first surface that faces in the first vertical direction.

49. The assembly of claim 41, wherein the terminal and the second cap have the same thickness where closest to one another, have different thickness where the second cap is adjacent to the second post and are coplanar with one another at a second surface that faces in the second vertical direction.

50. The assembly of claim 41, wherein the pad, the terminal and the caps are the same metals and include a gold, silver or nickel surface layer and are primarily copper, the posts and the base are copper, the electrical interconnect includes copper, the conductive trace includes a copper core shared by the pad, the terminal and the electrical interconnect and the heat spreader includes a copper core shared by the posts, the base and the caps.