Nitride semiconductor layers on substrate having ridge portions with inflow prevention walls near engraved regions
First Claim
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1. A nitride semiconductor light-emitting device comprising:
- a processed substrate comprising a nitride semiconductor, said substrate having a depressed portion, which is an engraved region, and a ridge portion, which is a non-engraved region;
a nitride semiconductor layer portion formed on a surface of both the depressed portion and the ridge portion and composed of a plurality of nitride semiconductor layers; and
inflow prevention walls formed on the ridge portion so that an inflow prevention wall is disposed at each end of the ridge portion near the depressed portion,wherein the height of the nitride semiconductor layer portion is greater at the end of the ridge portion near the depressed portion than elsewhere in the ridge portion,the nitride semiconductor layer portion forms a continuous film over the inflow prevention walls, the depressed portion, and the ridge portion, andthe inflow prevention wall comprises SiO2, Al2O3, TiO2, ZrO, or W.
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Abstract
On a processed substrate having an engraved region as a depressed portion formed thereon, a nitride semiconductor thin film is laid. The sectional area occupied by the nitride semiconductor thin film filling the depressed portion is 0.8 times the sectional area of the depressed portion or less.
42 Citations
13 Claims
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1. A nitride semiconductor light-emitting device comprising:
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a processed substrate comprising a nitride semiconductor, said substrate having a depressed portion, which is an engraved region, and a ridge portion, which is a non-engraved region; a nitride semiconductor layer portion formed on a surface of both the depressed portion and the ridge portion and composed of a plurality of nitride semiconductor layers; and inflow prevention walls formed on the ridge portion so that an inflow prevention wall is disposed at each end of the ridge portion near the depressed portion, wherein the height of the nitride semiconductor layer portion is greater at the end of the ridge portion near the depressed portion than elsewhere in the ridge portion, the nitride semiconductor layer portion forms a continuous film over the inflow prevention walls, the depressed portion, and the ridge portion, and the inflow prevention wall comprises SiO2, Al2O3, TiO2, ZrO, or W. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification