Method and system for hermetically sealing packages for optics
First Claim
1. A MEMS package adapted for wafer level probing of MEMS devices, the MEMS package comprising:
- a substrate comprising;
a plurality of MEMS chips, each of the plurality of MEMS chips including a plurality of devices, the plurality of MEMS chips being arranged in a spatial manner as a first array configuration, the first array configuration including a first separation region extending in a first direction between each of the plurality of individual chips and a second separation region extending in a second direction between each of the plurality of individual chips, the first direction being oriented at an angle with respect to the second direction; and
one or more bond pads located adjacent to each of the plurality of MEMS chips, wherein the one or more bond pads are in electrical communication with the plurality of devices in each of the plurality of MEMS chips; and
a transparent member of a predetermined thickness, the transparent member comprising;
a plurality of recessed regions within the predetermined thickness, wherein the plurality of recessed regions are arranged in a spatial manner as a second array aligned with the first array configuration, and wherein each of the plurality of recessed regions are bordered by a standoff region joined to the substrate, the standoff region having a thickness defined by a portion of the predetermined thickness; and
one or more access regions passing through the transparent member and providing wafer level probing access to the one or more bond pads.
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Abstract
A system for hermetically sealing devices includes a substrate, which includes a plurality of individual chips. Each of the chips includes a plurality of devices and each of the chips are arranged in a spatial manner as a first array. The system also includes a transparent member of a predetermined thickness, which includes a plurality of recessed regions arranged in a spatial manner as a second array and each of the recessed regions are bordered by a standoff region. The substrate and the transparent member are aligned in a manner to couple each of the plurality of recessed regions to a respective one of said plurality of chips. Each of the chips within one of the respective recessed regions is hermetically sealed by contacting the standoff region of the transparent member to the plurality of first street regions and second street regions using at least a bonding process to isolate each of the chips within one of the recessed regions.
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Citations
20 Claims
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1. A MEMS package adapted for wafer level probing of MEMS devices, the MEMS package comprising:
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a substrate comprising; a plurality of MEMS chips, each of the plurality of MEMS chips including a plurality of devices, the plurality of MEMS chips being arranged in a spatial manner as a first array configuration, the first array configuration including a first separation region extending in a first direction between each of the plurality of individual chips and a second separation region extending in a second direction between each of the plurality of individual chips, the first direction being oriented at an angle with respect to the second direction; and one or more bond pads located adjacent to each of the plurality of MEMS chips, wherein the one or more bond pads are in electrical communication with the plurality of devices in each of the plurality of MEMS chips; and a transparent member of a predetermined thickness, the transparent member comprising; a plurality of recessed regions within the predetermined thickness, wherein the plurality of recessed regions are arranged in a spatial manner as a second array aligned with the first array configuration, and wherein each of the plurality of recessed regions are bordered by a standoff region joined to the substrate, the standoff region having a thickness defined by a portion of the predetermined thickness; and one or more access regions passing through the transparent member and providing wafer level probing access to the one or more bond pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification