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Anti-tamper microchip package based on thermal nanofluids or fluids

  • US 8,288,857 B2
  • Filed: 09/17/2010
  • Issued: 10/16/2012
  • Est. Priority Date: 09/17/2010
  • Status: Expired due to Fees
First Claim
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1. A tamper-resistant microprocessor chip package comprising:

  • a microprocessor chip comprising silicon components;

    a fluid containment layer having at least one cavity and at least one chemical component;

    a lid, wherein said fluid containment layer is positioned between said lid and said microprocessor chip, and;

    fluid disposed in said cavity, whereby upon tampering and/or damaging said lid, said fluid and said chemical component are released onto a chip surface etching circuitry thereon, thereby destroying the electrical functionality of said microprocessor chip; and

    wherein said fluid is chosen from a group;

    potassium hydroxide, tetramethylammonium hydroxide, and hydrofluoric acid.

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