Anti-tamper microchip package based on thermal nanofluids or fluids
First Claim
1. A tamper-resistant microprocessor chip package comprising:
- a microprocessor chip comprising silicon components;
a fluid containment layer having at least one cavity and at least one chemical component;
a lid, wherein said fluid containment layer is positioned between said lid and said microprocessor chip, and;
fluid disposed in said cavity, whereby upon tampering and/or damaging said lid, said fluid and said chemical component are released onto a chip surface etching circuitry thereon, thereby destroying the electrical functionality of said microprocessor chip; and
wherein said fluid is chosen from a group;
potassium hydroxide, tetramethylammonium hydroxide, and hydrofluoric acid.
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Accused Products
Abstract
A tamper-resistant microchip package contains fluid- or nanofluid-filled capsules, channels, or reservoirs, wherein the fluids, either alone or in combination, can destroy circuitry by etching, sintering, or thermally destructing when reverse engineering of the device is attempted. The fluids are released when the fluid-filled cavities are cut away for detailed inspection of the microchip. Nanofluids may be used for the sintering process, and also to increase the thermal conductivity of the fluid for die thermal management. Through-vias and micro vias may be incorporated into the design to increase circuitry destruction efficacy by improving fluid/chip contact. Thermal interface materials may also be utilized to facilitate chip cooling.
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Citations
25 Claims
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1. A tamper-resistant microprocessor chip package comprising:
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a microprocessor chip comprising silicon components; a fluid containment layer having at least one cavity and at least one chemical component;
a lid, wherein said fluid containment layer is positioned between said lid and said microprocessor chip, and;fluid disposed in said cavity, whereby upon tampering and/or damaging said lid, said fluid and said chemical component are released onto a chip surface etching circuitry thereon, thereby destroying the electrical functionality of said microprocessor chip; and wherein said fluid is chosen from a group;
potassium hydroxide, tetramethylammonium hydroxide, and hydrofluoric acid. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A tamper-resistant microprocessor chip package comprising:
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a microprocessor chip; a plurality of fluid containment layers each having at least one cavity; and a lid and an underfill layer, wherein one of said plurality of fluid containment layers is positioned between said lid and said microprocessor chip, and one of said plurality of fluid containment layers is said underfill layer; and a fluid disposed in said at least one cavity, said fluid comprising at least one chemical component, whereby upon tampering and/or damaging said lid, said fluid and said chemical component are released on a microprocessor chip surface destroying the electrical functionality of said microprocessor chip by etching circuitry thereon, wherein said fluid is chosen from a group;
potassium hydroxide, tetramethylammonium hydroxide, and hydrofluoric acid. - View Dependent Claims (25)
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Specification