Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment

• US 8,289,039 B2
• Filed: 03/11/2009
• Issued: 10/16/2012
• Est. Priority Date: 03/11/2009
• Status: Active Grant

• Current Assignee: Teradyne Incorporated
• Original Assignee: Teradyne Incorporated
• Inventors: Breinlinger, Keith, Ostertag, Edward, Sartschev, Ronald A., Teneketges, Nicholas J.
• Primary Examiner(s): Velez, Roberto
• Application Number:
  US12/402,380
• Publication Number:
  US 20100231250A1
• Time in Patent Office: 1,315 Days
• Field of Search: 324/750.03, 324/750.14, 324/756.07
• US Class Current: 324/750.03
• CPC Class Codes: G01R 1/0458 related to environmental aspects, e.g. temperature
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence
• CPC Class Codes: G01R 31/2891 related to sensing or controlling of force, position, temperature G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05

Abstract

In one embodiment, a channel board-to-DIB junction multi-module is provided which includes performance critical channel electronics modules within an enclosure encasing the plurality of performance critical channel electronics modules. A coolant distribution apparatus is provided within the enclosure to provide cooling within the enclosure. A channel board connection apparatus is located at a channel board end of the channel board-to-DIB junction multi-module and a cable-less connection apparatus is located at a DIB end of the channel board-to-DIB junction multi-module.

Claims

1. An apparatus, comprising:

a connector configured to connect a channel board to device interface board (DIB), the connector comprising;

a) a plurality of channel electronics integrated circuits comprising pin electronics for a plurality of channels;

b) an enclosure at least partially enclosing the plurality of channel electronics integrated circuits;

c) a coolant distribution apparatus configured to provide cooling to the plurality of channel electronics integrated circuits;

d) a channel board connection portion coupled to the plurality of channel electronics integrated circuits and configured to couple electrical signals between the plurality of channel electronics integrated circuits and the channel board; and

e) a cable-less connection portion coupled to the plurality of channel electronics integrated circuits and configured to couple electrical signals between the plurality of channel electronics integrated circuits and the DIB, the cable-less connection portion being at least partially accessible through the enclosure of the connector.

2. The apparatus of claim 1, wherein the coolant distribution apparatus comprises fluid conduits within the enclosure.

3. The apparatus of claim 2, wherein the plurality of channel electronics integrated circuits are mounted in a frame of the enclosure comprising the fluid conduits.

4. The apparatus of claim 2, wherein the plurality of channel electronics integrated circuits are mounted in stiffeners within the enclosure, and wherein the stiffeners comprise the fluid conduits to direct a coolant medium within the enclosure.

5. The apparatus of claim 2, further comprising at least one heat sink, and wherein the fluid conduits are configured to direct coolant medium onto the at least one heat sink.

6. The apparatus of claim 2 further comprising a reverse heat sink positioned to direct coolant medium onto at least a portion of the plurality of channel electronics integrated circuits.

7. The apparatus of claim 2 further comprising impingement plates positioned to direct coolant medium upon at least a portion of the plurality of channel electronics integrated circuits.

8. The apparatus of claim 1, wherein the coolant distribution apparatus comprises at least one cold plate in contact with the plurality of channel electronics integrated circuits.

9. The apparatus of claim 1, wherein the channel board connection portion is positioned at a channel board end of the connector, and wherein the coolant distribution apparatus comprises input and return fluid connections at the channel board end of the connector.

10. The apparatus of claim 1, wherein the channel board connection portion comprises a cable.

11. Automated test equipment adapted for use with a device interface board (DIB), the automated test equipment comprising:

(a) a test head comprising;

1) a plurality of channel boards; and

2) a plurality of channel board-to-DIB connector modules configured to electrically connect the plurality of channel boards to the DIB, the plurality of channel board-to-DIB connector modules each comprising;

i) a plurality of channel electronics; and

ii) a cable-less connection apparatus configured to couple electrical signals between the plurality of channel electronics and the DIB; and

3) a coolant distribution apparatus configured to cool at least some of the plurality of channel electronics.

12. The automated test equipment of claim 11, wherein the coolant distribution apparatus comprises input and return fluid connections proximate a channel board end of the plurality of channel board-to-DIB connector modules.

13. The automated test equipment of claim 11, wherein at least one of the channel board-to-DIB connector modules comprises an enclosure at least partially enclosing the plurality of channel electronics of the at least one of the channel board-to-DIB connector modules, and wherein the enclosure is sealed and the coolant distribution apparatus comprises fluid conduits to provide coolant medium into the enclosure and onto the plurality of channel electronics of the at least one of the channel board-to-DIB connector modules.

14. The automated test equipment of claim 13, wherein the at least one of the channel board-to-DIB connector modules further comprises a heat sink, and wherein the fluid conduits are configured to direct coolant medium onto the heat sink.

15. The automated test equipment of claim 13, further comprising a reverse heat sink positioned to direct coolant medium onto at least some of the plurality of channel electronics.

16. The automated test equipment of claim 13, further comprising impingement plates positioned to direct coolant medium upon at least some of the plurality of channel electronics.

17. The automated test equipment of claim 11, wherein the coolant distribution apparatus comprises at least one cold plate in contact with at least some of the plurality of channel electronics.

18. The automated test equipment of claim 11, wherein at least one of the channel board-to-DIB connector modules comprises a cable connecting the channel board-to-DIB connector module to a channel board of the plurality of channel boards.

19. Automated test equipment adapted for use with a device interface board (DIB), the automated test equipment comprising:

a) a test head comprising;

1) at least one channel board comprising a first channel board;

2) a plurality of channel board-to-DIB connector modules configured to electrically connect the first channel board to the DIB, each of the plurality of channel board-to-DIB connector modules comprising;

i) channel electronics;

ii) an enclosure at least partially enclosing the channel electronics, the enclosure having an opening therein; and

iii) a cable-less connection apparatus coupled to the channel electronics and having a portion exposed in the opening, the exposed portion being adapted to couple to the DIB; and

3) coolant distribution apparatus configured to distribute a coolant medium onto the channel electronics.

20. The automatic test equipment of claim 19, wherein the coolant distribution apparatus is a liquid immersion coolant apparatus and comprises fluid conduits to provide coolant medium into the enclosure and along the channel electronics.

21. The automatic test equipment of claim 20, further comprising a heat sink, and wherein the fluid conduits are configured to direct coolant medium onto the heat sink.

22. The automatic test equipment of claim 20 further comprising a reverse heat sink positioned to direct coolant medium onto the channel electronics.

23. The automatic test equipment of claim 20 further comprising impingement plates positioned to direct coolant medium upon the channel electronics.

24. The automatic test equipment of claim 19, wherein the channel electronics are mounted in stiffeners within the enclosure, and wherein the stiffeners comprise fluid conduits.

25. The automatic test equipment of claim 19, wherein at least one of the plurality of channel board-to-DIB connector modules comprises a cable connecting the at least one channel board-to-DIB connector module to the first channel board.