Semiconductor device and manufacturing method thereof

• US 8,289,164 B2
• Filed: 07/29/2010
• Issued: 10/16/2012
• Est. Priority Date: 12/12/2003
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Yamazaki, Shunpei, Koyama, Jun, Akiba, Mai
• Primary Examiner(s): Previl, Daniel
• Application Number:
  US12/846,104
• Publication Number:
  US 20100295683A1
• Time in Patent Office: 810 Days
• Field of Search: 3405721-5729, 340/568.1, 340/539.1, 235/492, 438/153, 438/155, 438/238, 438/280
• US Class Current: 340/572.1
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1218 with a particular composition or structure of the substrate
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 29/78603 characterised by the insulating substrate or support H01L29/78657 takes precedence
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

A semiconductor device typified by a wireless tag, which has improved mechanical strength, can be formed by a more simple process at a low cost and prevent radio waves from being shielded, and a manufacturing method of the semiconductor device. According to the invention, a wireless tag includes a thin film integrated circuit formed of an isolated TFT having a thin film semiconductor film. The wireless tag may be attached directly to an object, or attached to a flexible support such as plastic and paper before being attached to an object. The wireless tag of the invention may include an antenna as well as the thin film integrated circuit. The antenna allows to communicate signals between a reader/writer and the thin film integrated circuit, and to supply a power source voltage from the reader/writer to the thin film integrated circuit.

Claims

1. A semiconductor device comprising:

a flexible substrate;

a first antenna provided over the flexible substrate;

a second antenna provided over the flexible substrate; and

an integrated circuit provided over the flexible substrate, the integrated circuit being electrically connected to the first antenna,

wherein the flexible substrate is configured to be folded along a fold line so that the second antenna is electrically coupled connected to the first antenna.

2. The semiconductor device according to claim 1,

wherein a part of the integrated circuit is provided over the first antenna.

3. The semiconductor device according to claim 1,

wherein the first antenna includes a first terminal, and the second antenna includes a second terminal, and

wherein the first terminal and the second terminal are electrically connected.

4. The semiconductor device according to claim 3, wherein the first terminal is covered with a conductive resin.

5. The semiconductor device according to claim 1,

wherein a part of the first antenna is covered with an insulating resin.

6. The semiconductor device according to claim 1, wherein the integrated circuit is a thin film integrated circuit.

7. The semiconductor device according to claim 1,

wherein the flexible substrate is configured to be folded so that the first antenna, the second antenna and the integrated circuit are put inside the flexible substrate.

8. A semiconductor device comprising:

a flexible substrate;

a first antenna provided over the flexible substrate;

a second antenna provided over the flexible substrate; and

and integrated circuit provided over the flexible substrate, integrated circuit being electrically connected to the first antenna,

wherein the flexible substrate is configured to be folded along a fold line so that the second antenna is electrically connected to the first antenna, and

wherein the integrated circuit comprises a transistor comprising a semiconductor film.

9. The semiconductor device according to claim 8,

wherein a part of the integrated circuit is provided over the first antenna.

10. The semiconductor device according to claim 8,

wherein the first antenna includes a first terminal, and the second antenna includes a second terminal, and

wherein the first terminal and the second terminal are electrically connected.

11. The semiconductor device according to claim 10, wherein the first terminal is covered with a conductive resin.

12. The semiconductor device according to claim 8,

wherein a part of the first antenna is covered with an insulating resin.

13. The semiconductor device according to claim 8, wherein the integrated circuit is a thin film integrated circuit.

14. The semiconductor device according to claim 8,

wherein the flexible substrate is configured to be folded so that the first antenna, the second antenna and the integrated circuit are put inside the flexible substrate.

15. A semiconductor device comprising:

a flexible substrate;

a first antenna provided on the flexible substrate;

a second antenna provided on the flexible substrate; and

a integrated circuit provided between the first antenna and the second antenna, the integrated circuit being electrically connected to the first antenna,

wherein the flexible substrate is folded along a fold line so that the second antenna is electrically connected to the first antenna.

16. The semiconductor device according to claim 15,

wherein a part of the integrated circuit is provided between the first antenna and the second antenna.

17. The semiconductor device according to claim 15,

wherein the first antenna includes a first terminal, and the second antenna includes a second terminal, and

wherein the first terminal and the second terminal are electrically connected.

18. The semiconductor device according to claim 17, wherein the first terminal is covered with a conductive resin.

19. The semiconductor device according to claim 15,

wherein a part of the first antenna is covered with an insulating resin.

20. The semiconductor device according to claim 15, wherein the integrated circuit is a thin film integrated circuit.

21. The semiconductor device according to claim 15,

wherein the flexible substrate is configured to be folded so that the first antenna, the second antenna and the integrated circuit are put inside the flexible substrate.

22. A semiconductor device comprising:

a flexible substrate;

a first antenna provided on the flexible substrate; and

a second antenna provided on the flexible substrate; and

an integrated circuit provided between the first antenna and the second antenna, the integrated circuit being electrically connected to the first antenna,

wherein the flexible substrate is folded along a fold line so that the second antenna is electrically connected to the first antenna, and

wherein the integrated circuit comprises a transistor comprising a semiconductor film.

23. The semiconductor device according to claim 22,

wherein a part of the integrated circuit is provided between the first antenna and the second antenna.

24. The semiconductor device according to claim 22,

wherein the first antenna includes a first terminal, and the second antenna includes a second terminal, and

wherein the first terminal and the second terminal are electrically connected.

25. The semiconductor device according to claim 24, wherein the first terminal is covered with a conductive resin.

26. The semiconductor device according to claim 22, wherein a part of the first antenna is covered with an insulating resin.

27. The semiconductor device according to claim 22, wherein the integrated circuit is a thin film integrated circuit.

28. The semiconductor device according to claim 22,

wherein the flexible substrate is configured to be folded so that the first antenna, the second antenna and the integrated circuit are put inside the flexible substrate.