Integrated thermal packaging of high power motor controller

• US 8,289,711 B2
• Filed: 08/20/2010
• Issued: 10/16/2012
• Est. Priority Date: 08/20/2010
• Status: Active Grant

• Current Assignee: Hamilton Sundstrand Corporation (Raytheon Technologies Corporation d/b/a RTX)
• Original Assignee: Hamilton Sundstrand Corporation (Raytheon Technologies Corporation d/b/a RTX)
• Inventors: Pal, Debabrata
• Primary Examiner(s): THOMPSON, GREGORY D
• Application Number:
  US12/859,816
• Publication Number:
  US 20120044646A1
• Time in Patent Office: 788 Days
• Field of Search: 361/702
• US Class Current: 361/702
• CPC Class Codes: H05K 7/20909 Forced ventilation, e.g. on heat dissipaters coupled to components
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change
• CPC Class Codes: Y10T 29/49826 Assembling or joining

Abstract

According to an example provided herein, a cold plate has a surface for mounting a component thereto, a first path to flow cooling fluid therethrough in a vicinity of the surface and a housing mounted on the surface that extends from the surface. The housing has a second path attaching to the first path to flow fluid to flow through the housing wherein the housing is designed to at least partially enclose the component and wherein the component is cooled by the housing.

Claims

1. A cold plate comprising:

a surface of a body for mounting a component to said surface,

a first path to flow cooling fluid through said body in a vicinity of said surface and

a housing having an inner diameter and an outer diameter and a space in between said inner and outer diameter, said housing mounted on said surface and extending therefrom, said housing having a second path attaching to said first path to flow fluid through said housing, wherein said housing is designed to at least partially enclose said component, wherein said component is cooled by said housing wherein said second path includes fin cores disposed within said space of said housing and wherein said housing is for contact with said component.

2. The cold plate of claim 1 wherein said housing further comprises an outer wall for mounting an electrical part wherein said electrical part is cooled by said housing.

3. The cold plate of claim 1 wherein said component has a first shape and said housing is designed with a second shape that mimics said first shape.

4. The cold plate of claim 1 wherein said second path is tortuous.

5. A cold plate comprising:

a surface having a component requiring cooling mounted thereto,

a first path to flow cooling fluid therethrough in a vicinity of said surface for cooling said surface, and,

a housing having an inner diameter and an outer diameter and a space in between said inner and outer diameter, said housing mounted on said surface and extending therefrom, said housing having a second path attaching to said first path to flow fluid through said housing for cooling said housing, wherein said housing at least partially encloses said component and wherein said component is cooled by said housing wherein said second path includes fin cores disposed within said space of said housing.

6. The cold plate of claim 5 wherein said housing further comprises an outer wall for mounting a part requiring cooling wherein said part is cooled by said housing.

7. The cold plate of claim 5 wherein said component has a first shape and said housing has a second shape that mimics said first shape.

8. The cold plate of claim 5 wherein said second path is tortuous.

9. The cold plate of claim 5 wherein said component is an inductor.

10. The cold plate of claim 6 wherein said part is an inverter power module and said component is an inductor.

11. The cold plate of claim 9 wherein said inductor further comprises a coil, windings disposed about said coil and potting compound disposed between said coil and said housing.

12. The cold plate of claim 5 wherein potting compound is disposed between said component and said housing.

13. The cold plate of claim 5 wherein said component has a first shape and said housing has a second shape that mimics said first shape and is in close proximity to said first shape.

14. The cold plate of claim 5 wherein said component is in contact with said housing.