Differential ultrasonic waveguide cure monitoring probe

• US 8,291,744 B2
• Filed: 06/09/2009
• Issued: 10/23/2012
• Est. Priority Date: 06/09/2008
• Status: Expired due to Fees

• Current Assignee: Materials And Sensors Technologies, Inc.
• Original Assignee: Materials And Sensors Technologies, Inc.
• Inventors: Djordjevic, Borislav B., Rouch, Lawrence L.
• Primary Examiner(s): Macchiarolo, Peter
• Assistant Examiner(s): MILLER, ROSE MARY
• Application Number:
  US12/481,141
• Publication Number:
  US 20090314088A1
• Time in Patent Office: 1,232 Days
• Field of Search: 73/18.2, 73/18.6, 736/17, 736/44, 736/09
• US Class Current: 73/1.86
• CPC Class Codes: G01N 2203/0092 Visco-elasticity, solidification, curing, cross-linking degree, vulcanisation or strength properties of semi-solid materials
• CPC Class Codes: G01N 2291/0251 Solidification, icing, curing composites, polymerisation
• CPC Class Codes: G01N 29/028 by measuring mechanical or acoustic impedance
• CPC Class Codes: G01N 29/09 by measuring mechanical or acoustic impedance
• CPC Class Codes: G01N 29/11 by measuring attenuation of acoustic waves
• CPC Class Codes: G01N 29/2462 Probes with waveguides, e.g. SAW devices
• CPC Class Codes: G01N 29/4427 with stored values, e.g. threshold values

Abstract

The present invention is seen to provide a new methodology, testing system designs and concept to enable in situ real time monitoring of the cure process. Apparatus, system, and method for the non-destructive, in situ monitoring of the time dependent curing of advanced materials using one or more differential ultrasonic waveguide cure monitoring probes. A differential ultrasonic waveguide cure monitoring probe in direct contact with the material to be cured and providing in situ monitoring of the cure process to enable assessment of the degree of cure or cure level in a non-cure related signal variances (e.g., temperature) independent calibrated response manner. A differential ultrasonic waveguide cure monitoring probe including a transducer coupled to a waveguide and incorporating correction and calibration methodology to accurately and reproducibly monitor the cure process and enable assessment of cure level via ultrasonic reflection measurements. The amplitude of the corrected interface response signal reflected from the probe-resin interface indicating changes in the modulus of the material during the cure.

Claims

1. A differential ultrasonic waveguide cure monitoring probe for in situ ultrasonic monitoring of a material undergoing a cure process, the probe comprising:

an ultrasonic transducer;

a waveguide having a proximal end in contact with the ultrasonic transducer and a distal end for contacting the material undergoing the cure process, the waveguide comprising;

a first portion extending from the proximal end;

a reference of the waveguide;

a second portion extending from the reference to a tip at the distal end of the waveguide;

wherein the tip further comprises a lip located on the circumference of the tip;

wherein an ultrasonic signal can be generated by the ultrasonic transducer and transmitted into the waveguide;

thereby generating an interface signal by a portion of the ultrasonic signal reflecting back from the interface of the probe and the material undergoing a cure, the interface signal reflecting back to the ultrasonic transducer, the interface signal being used to directly sense the mechanical modulus change of the curing material; and

thereby generating a reference signal by a portion of the ultrasonic signal reflecting back from the reference, the reference signal reflecting back to the ultrasonic transducer, the reference signal being used to recalibrate the probe and account for non-cure related signal variances during the cure process;

wherein a quantitative assessment of a cure level of the material undergoing the cure process is determined in a non-cure related signal variances independent calibrated response manner using the reference signal to correct/recalibrate the interface signal.

2. The differential ultrasonic waveguide cure monitoring probe of claim 1, wherein the response signal is internal to the probe and independently influenced by the probe environment and can be used to continuously correct and recalibrate the probe response as measured by the interface signal, which measures changes in signal reflection/transmission due to impedance change in the curing material.

3. The differential ultrasonic waveguide cure monitoring probe of claim 1, wherein the waveguide reference further comprises a cross-section reference, the cross-sectional reference comprising:

a first portion having an first cross-sectional area; and

a second portion having a second cross-sectional area, the second cross-sectional area being smaller that the first cross-sectional area;

wherein the reference is the portion of the first cross-sectional area that extends beyond the second cross-sectional area.

4. The differential ultrasonic waveguide cure monitoring probe of claim 1, wherein the waveguide reference further comprises a slot reference, the slot reference comprising a slot in the waveguide extending from a side of the waveguide toward a center of the waveguide and substantially orthogonal to a longitudinal centerline of the waveguide.

5. The differential ultrasonic waveguide cure monitoring probe of claim 1, wherein the waveguide reference further comprises a small transducer cross-section reference.

6. The differential ultrasonic waveguide cure monitoring probe of claim 1, wherein the waveguide reference further comprises an insert/void reference.

7. The differential ultrasonic waveguide cure monitoring probe of claim 1, wherein the waveguide further comprises an alternate geometry, the alternate geometry comprising an angled body wherein the second portion of the waveguide extends at an angle relative to the first portion of the waveguide.

8. The differential ultrasonic waveguide cure monitoring probe of claim 1, wherein the probe is in direct contact with the material undergoing the cure process, the probe is only connected to one side of the material being cured, and the cure monitoring is performed in situ to allow real time monitoring of the cure process.

9. The differential ultrasonic waveguide cure monitoring probe of claim 1, wherein the probe is initially calibrated before the cure process using a material having known characteristics and wherein the probe is continuously calibrated during the cure process using the reference signal to account for non-cure related signal variances during the cure process in order to provide quantitative assessment and comparison of cure rates and degree of cure completion.

10. The differential ultrasonic waveguide cure monitoring probe of claim 1, wherein the material being cured comprises any thermo-setting material.

11. The differential ultrasonic waveguide cure monitoring probe of claim 1, further comprising a front face located at the tip, the front surface suitable for direct contact with the cure material and for ensuring coupling of the ultrasonic signal across the probe/material interface.

12. The differential ultrasonic waveguide cure monitoring probe of claim 11, wherein the tip and front face further comprise a critical angle reflection structure.

13. The differential ultrasonic waveguide cure monitoring probe of claim 12, wherein the critical angle reflection structure further comprises multiple surface refection geometry waveguide terminations.

15. A differential ultrasonic waveguide cure monitoring system comprising:

a differential ultrasonic waveguide cure monitoring probe according to claim 1 or claim 14;

a computer coupled to the differential ultrasonic waveguide cure monitoring probe, the computer comprising;

an input device for receiving information relating to the reference signal and the interface signal;

a processor for analyzing the information relating to the reference signal and the interface signal and for distinguishing the propagation differences between the response signal and the interface signal to estimate the cure material modulus to determine a quantitative cure state of the material in a non-cure related signal variances independent calibrated response manner;

a data storage device for storing one or more of;

the information relating to the reference signal and the interface signal, information relating to the material being cured, and information relating to the cure process;

an output device for outputting one or more of;

the information relating to the reference signal and the interface signal, information relating to the material being cured, and information relating to the cure process.

16. The system of claim 15, further comprising:

a signal gate for controlling sampling rate;

an A/D converter;

a pulser/receiver card for controlling pulse generation and receipt of the reflected signals; and

a channel multiplexer board for signal multiplexing.

17. The system of claim 15, wherein the probe is integrated into new computerized cure process monitoring system.

18. The system of claim 15, wherein the probe is retrofit into existing materials processing assemblies.

19. The system of claim 15, further comprising tooling mounting options for coupling the differential ultrasonic waveguide probe to the material to be cured.

14. A differential ultrasonic waveguide cure monitoring probe for in situ ultrasonic monitoring of a material undergoing a cure process, the probe comprising:

an ultrasonic transducer;

a waveguide having a proximal end in contact with the ultrasonic transducer and a distal end for contacting the material undergoing the cure process, the waveguide comprising;

a first portion extending from the proximal end;

a reference of the waveguide;

a second portion extending from the reference to a tip at the distal end of the waveguide;

wherein the waveguide further comprises an alternate geometry, the alternate geometry comprising an angled body wherein the second portion of the waveguide extends at an angle relative to the first portion of the waveguide;

wherein an ultrasonic signal can be generated by the ultrasonic transducer and transmitted into the waveguide;

thereby generating an interface signal by a portion of the ultrasonic signal reflecting back from the interface of the probe and the material undergoing a cure, the interface signal reflecting back to the ultrasonic transducer, the interface signal being used to directly sense the mechanical modulus change of the curing material; and

thereby generating a reference signal by a portion of the ultrasonic signal reflecting back from the reference, the reference signal reflecting back to the ultrasonic transducer, the reference signal being used to recalibrate the probe and account for non-cure related signal variances during the cure process;

wherein a quantitative assessment of a cure level of the material undergoing the cure process is determined in a non-cure related signal variances independent calibrated response manner using the reference signal to correct/recalibrate the interface signal.