LED light module for street lamp and method of manufacturing same
First Claim
1. A method of manufacturing an LED light module comprises steps of:
- (1) providing a frame with electrodes and a heat sink being secured therein, and an LED chip being attached onto a top of the heat sink, thereby the frame being assembled;
(2) preheating the frame;
(3) forming a silicon lens on the assembled frame through an in-mold process so as to obtain an LED light module; and
releasing the LED light module from the mold and further baking the same;
wherein at the step of (3), the frame is mounted in a mold with the LED chip upward to a cavity of the mold, and the mold is designed with the cavity in a shape of peanut;
silicon resin is injected into and filled in the cavity of the mold;
thereafter, the mold is heated, thus the silicon resin is cured to form a silicon lens on the frame and seals the LED chip on the top of the heat sink;
herein, the silicon lens is in a shape of peanut, and intimately engaged with a surface of the LED chip.
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Accused Products
Abstract
An LED light module (100) for street lamp includes a frame (1), electrodes (5) and a heat sink (4) mounted in the frame, an LED chip (2) attached on a top of the heat sink; and a silicon lens (3) formed on the frame and closely sealing the LED chip therein. The LED light module is an integral structure with the silicon lens being formed thereon through an in-mold process. The silicon lens lengthwise includes two convergent parts (31, 33) at either end and a depressed part (32) at middle thereof for consecutively bridging the two convergent parts. Thus the exit light beam from the LED light module is elongated without light loss. A one-body molding process for manufacturing the LED light module is disclosed as well, which is in high-efficiency, and adapted for a mass production.
58 Citations
11 Claims
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1. A method of manufacturing an LED light module comprises steps of:
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(1) providing a frame with electrodes and a heat sink being secured therein, and an LED chip being attached onto a top of the heat sink, thereby the frame being assembled; (2) preheating the frame; (3) forming a silicon lens on the assembled frame through an in-mold process so as to obtain an LED light module; and releasing the LED light module from the mold and further baking the same; wherein at the step of (3), the frame is mounted in a mold with the LED chip upward to a cavity of the mold, and the mold is designed with the cavity in a shape of peanut;
silicon resin is injected into and filled in the cavity of the mold;
thereafter, the mold is heated, thus the silicon resin is cured to form a silicon lens on the frame and seals the LED chip on the top of the heat sink;
herein, the silicon lens is in a shape of peanut, and intimately engaged with a surface of the LED chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification