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Semiconductor substrate, method of fabricating the same, semiconductor device, and method of fabricating the same

  • US 8,294,183 B2
  • Filed: 12/30/2009
  • Issued: 10/23/2012
  • Est. Priority Date: 06/10/2009
  • Status: Expired due to Fees
First Claim
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1. A semiconductor substrate, comprising:

  • a substrate;

    a first semiconductor layer arranged on the substrate;

    a metallic material layer arranged on the first semiconductor layer;

    a second semiconductor layer in direct physical contact with the first semiconductor layer and the metallic material layer; and

    voids formed in the first semiconductor layer under the metallic material layer.

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