Panelized backside processing for thin semiconductors

• US 8,294,280 B2
• Filed: 05/07/2009
• Issued: 10/23/2012
• Est. Priority Date: 05/07/2009
• Status: Active Grant

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: Chandrasekaran, Arvind
• Primary Examiner(s): Trinh, Hoa B
• Application Number:
  US12/437,168
• Publication Number:
  US 20100283160A1
• Time in Patent Office: 1,265 Days
• Field of Search: 257685-686, 257777-784, 257/E23.168
• US Class Current: 257/777
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/11 Manufacturing methods
• CPC Class Codes: H01L 2224/11002 for supporting the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/13025 the bump connector being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/14051 Bump connectors having different shapes
• CPC Class Codes: H01L 2224/14181 On opposite sides of the body
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73259 Bump and HDI connectors
• CPC Class Codes: H01L 2224/92224 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 2224/94 at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06517 : Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06541 : Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV] manufacturing via connections per se H01L21/76898
• CPC Class Codes: H01L 2225/06568 : the devices decreasing in size, e.g. pyramidical stack
• CPC Class Codes: H01L 2225/06572 : Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/18161 : of a flip chip
• CPC Class Codes: H01L 2924/3511 : Warping

Abstract

A semiconductor manufacturing method includes attaching a first die to a substrate panel. The method also includes applying a mold compound after attaching the first die to the substrate panel to the first die and the substrate panel. The method further includes thinning the first die and the mold compound after applying the mold compound. Attaching the die to the substrate panel before thinning eliminates usage of a carrier wafer when processing thin semiconductors.

Claims

1. A semiconductor device, comprising:

a substrate;

a first die having a through substrate via, a first surface and a second surface opposite the first surface, the first surface being supported by the substrate;

a packaging connection between the substrate and the first die, the packaging connection coupled to the through substrate via to facilitate communication between the substrate and the first die;

a first molding compound between the substrate and the first die, the first molding compound partially surrounding the first die, a sidewall of the first molding compound being flush with a sidewall of the substrate; and

an isolation layer supported in part by the first molding compound, the isolation layer extending substantially a length of the substrate.

2. The semiconductor device of claim 1, further comprising a second die coupled to the first die.

3. The semiconductor device of claim 2, further comprising a second molding compound partially surrounding the second die, a sidewall of the second molding compound being flush with the sidewall of the first molding compound and a sidewall of the isolation layer, a surface of the second molding compound being adjacent with a second surface of the isolation layer.

4. The semiconductor device of claim 1, further comprising back end of line layers co-planar with the first molding compound.

7. The device of claim 1, in which the semiconductor device is integrated into at least one of a communications device, a music player, a video player, an entertainment unit, a navigation device, a computer, a personal digital assistant, and a fixed location data unit.

5. A semiconductor device, comprising:

a die having a through substrate via and a first surface supported by a substrate;

a packaging connection between the substrate and the die, the packaging connection coupled to the through substrate via to facilitate communication between the substrate and the die;

means for encapsulating the die, the encapsulating means being between the substrate and the die and partially surrounding the die, a sidewall of the encapsulating means being flush with a sidewall of the substrate; and

means for electrically isolating the die, the isolation means supported in part by the encapsulating means, the isolation means extending substantially a length of the substrate.

6. The device of claim 5, in which the semiconductor device is integrated into at least one of a communications device, a music player, a video player, an entertainment unit, a navigation device, a computer, a personal digital assistant, and a fixed location data unit.