Method of manufacturing a microradio
First Claim
1. A method for manufacturing a micro radio comprising the steps of:
- cutting a wafer of silicon into a plurality of components;
coating each of said components with a conductive adhesive; and
coupling a hysteretic switch with each of said components, wherein said hysteretic switch further comprises two transistors.
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Accused Products
Abstract
A microradio is provided with a hysteretic switch to permit an optimum range increasing charging cycle, with the charging cycle being long relative to the transmit cycle. Secondly, an ensemble of microradios permits an n2 power enhancement to increase range with coherent operation. Various multi-frequency techniques are used both for parasitic powering and to isolate powering and transmit cycles. Applications for microradios and specifically for ensembles of microradios include authentication, tracking, fluid flow sensing, identification, terrain surveillance including crop health sensing and detection of improvised explosive devices, biohazard and containment breach detection, and biomedical applications including the use of microradios attached to molecular tags to destroy tagged cells when the microradios are activated. Microradio deployment includes the use of paints or other coatings containing microradios, greases and aerosols. Moreover, specialized antennas, including microcoils, mini dipoles, and staircase coiled structures are disclosed, with the use of nano-devices further reducing the size of the microradios.
21 Citations
20 Claims
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1. A method for manufacturing a micro radio comprising the steps of:
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cutting a wafer of silicon into a plurality of components; coating each of said components with a conductive adhesive; and coupling a hysteretic switch with each of said components, wherein said hysteretic switch further comprises two transistors. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method for manufacturing a micro radio comprising the steps of:
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cutting a wafer of silicon into a plurality of components; coating each of said components with a conductive adhesive; attaching a rectifier to each of said components attaching an oscillator to each of said components; and coupling at least one capacitor to said oscillator with a hysteretic switch, wherein said hysteretic switch comprises at least two transistors.
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Specification