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Methods for manufacturing packaged systems for implanting markers in a patient

  • US 8,297,030 B2
  • Filed: 08/02/2011
  • Issued: 10/30/2012
  • Est. Priority Date: 12/30/2002
  • Status: Expired due to Fees
First Claim
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1. In localization systems that involve implanting markers in a patent, a method for manufacturing a packaged system for implanting a marker in a patient, comprising:

  • providing a first marker having a first casing configured to be implanted in a patient and a first resonating circuit in the first casing, wherein the first resonating circuit comprises a first coil configured to wirelessly transmit a first target signal in response to a wirelessly transmitted first excitation signal;

    preloading the first marker into a first cannula of a first introducer; and

    sealing the first introducer with the first marker in the first cannula in a compartment of a package.

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