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MEMS devices having support structures with substantially vertical sidewalls and methods for fabricating the same

  • US 8,298,847 B2
  • Filed: 04/23/2010
  • Issued: 10/30/2012
  • Est. Priority Date: 08/19/2005
  • Status: Expired due to Fees
First Claim
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1. A method of fabricating a MEMS device, comprising:

  • providing a substrate;

    depositing an electrode layer over the substrate;

    depositing a sacrificial layer over the electrode layer;

    depositing a movable layer over the sacrificial layer;

    patterning the movable layer to form an aperture extending through the movable layer, thereby exposing a portion of the sacrificial layer;

    etching the exposed portion of the sacrificial layer to form a cavity extending through the sacrificial layer and undercutting a portion of the movable layer; and

    depositing a layer of self-planarizing support material to fill the cavity.

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