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RFID tag and manufacturing method thereof

  • US 8,299,925 B2
  • Filed: 07/25/2008
  • Issued: 10/30/2012
  • Est. Priority Date: 10/26/2007
  • Status: Expired due to Fees
First Claim
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1. A manufacturing method of an RFID tag comprising:

  • forming a conductive pattern and a communication antenna on a surface of a heat-softening base sheet;

    mounting a second semiconductor element on the conductive pattern, with a thermosetting adhesive sandwiched therebetween;

    heating the heat-softening base sheet mounted with the second semiconductor element, to harden the thermosetting adhesive and to form, by the heating to harden the thermosetting adhesive, a recess having a greater dimension than the second semiconductor element in a portion of the base sheet where the second semiconductor element is mounted;

    mounting a first semiconductor element having a greater dimension than the recess astride the recess of the base sheet;

    connecting the first semiconductor element to the conductive pattern; and

    connecting at least any of the first semiconductor element and the second semiconductor element to the communication antenna on the base sheet.

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