Inductively coupled module and item with inductively coupled module

• US 8,299,929 B2
• Filed: 03/05/2009
• Issued: 10/30/2012
• Est. Priority Date: 09/26/2006
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kato, Noboru, Murata, Tsuneo
• Primary Examiner(s): MULLEN, THOMAS J
• Application Number:
  US12/398,497
• Publication Number:
  US 20090160619A1
• Time in Patent Office: 1,335 Days
• Field of Search: 340/572.1, 340/572.7, 340/572.8, 340/693.5, 340/10.1, 361/749, 343/872
• US Class Current: 340/572.7
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation

Abstract

An inductively coupled module includes a wireless IC chip and a feeder circuit substrate which is connected to the wireless IC chip and which includes a feeder circuit including an inductance element and a capacitance element. The feeder circuit substrate is made of a biodegradable plastic so as to prevent a negative impact of the module on the environment and the human body. The inductively coupled module is adhered on a radiation plate and is used as a wireless IC device of an RFID system.

Claims

1. An item including an inductively coupled module, wherein

the item is one of a package or a container for holding food, drink, or medicine;

the item includes a metal element that defines a radiation plate;

the inductively coupled module includes a wireless IC chip and a feeder circuit substrate connected to the wireless IC chip, the feeder circuit substrate including a feeder circuit;

the feeder circuit of the inductively coupled module is coupled to the metal element of the item via electromagnetic coupling; and

at least one of the wireless IC chip and the feeder circuit substrate is made of a biodegradable plastic.

2. The item according to claim 1, wherein the biodegradable plastic is one of a plant-derived aliphatic plastic, a natural plastic, and a bioplastic.

3. The item according to claim 1, wherein the feeder circuit substrate is a multilayer substrate including a plurality of stacked biodegradable plastic layers.

4. The item according to claim 1, wherein the feeder circuit substrate is a single-layer substrate made of a biodegradable plastic.

5. The item according to claim 1, wherein the feeder circuit substrate is flexible.

6. The item according to claim 1, wherein

the feeder circuit includes a resonant circuit that includes an inductance element;

the feeder circuit is arranged to supply a transmission signal having a predetermined frequency or to receive a reception signal having the predetermined frequency; and

the resonant circuit is arranged to resonate at the predetermined frequency.