Packaging material with electromagnetic coupling module
First Claim
1. A packaging material with an electromagnetic coupling module comprising:
- a packaging material including a liner, and a core material connected to the liner; and
an electromagnetic coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element and has a predetermined resonant frequency;
whereinthe electromagnetic coupling module is arranged inside of the packaging material; and
at least one of the liner or the core material is a dielectric, the feeder circuit board being electromagnetically coupled with the at least one of the liner or the core material which is the dielectric, and arranged to radiate a transmission signal supplied from the resonant circuit through electromagnetic coupling and/or to supply the resonant circuit with a received reception signal through the electromagnetic coupling.
1 Assignment
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Accused Products
Abstract
A packaging material includes an electromagnetic coupling module for an RFID system, in which a radio IC chip is protected from external shock and environmental change without affecting the planarity of the packaging material, the assembly including an electromagnetic coupling module is facilitated, and the radiation characteristics are satisfactory. A packaging material includes a liner and a wave-shaped core material, wherein an electromagnetic coupling module is arranged inside of the packaging material. The electromagnetic coupling module includes a radio IC chip and a feeder circuit board, on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element. The packaging material is made of a dielectric, wherein the dielectric and the electromagnetic coupling module are electromagnetically coupled to transmit/receive high frequency signals.
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Citations
7 Claims
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1. A packaging material with an electromagnetic coupling module comprising:
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a packaging material including a liner, and a core material connected to the liner; and an electromagnetic coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element and has a predetermined resonant frequency;
whereinthe electromagnetic coupling module is arranged inside of the packaging material; and at least one of the liner or the core material is a dielectric, the feeder circuit board being electromagnetically coupled with the at least one of the liner or the core material which is the dielectric, and arranged to radiate a transmission signal supplied from the resonant circuit through electromagnetic coupling and/or to supply the resonant circuit with a received reception signal through the electromagnetic coupling. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification