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Semiconductor device and a method of manufacturing the same

  • US 8,300,201 B2
  • Filed: 08/08/2011
  • Issued: 10/30/2012
  • Est. Priority Date: 03/13/2000
  • Status: Expired due to Fees
First Claim
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1. A semiconductor device comprising:

  • a first substrate;

    reverse stagger type thin film transistors, comprising an amorphous semiconductor layer and arranged in a matrix shape in a pixel region over the first substrate;

    a second substrate on which an opposing electrode corresponding to said pixel region is formed;

    a plurality of third substrates made from glass or quartz;

    a first driver circuit over one of the plurality of third substrates;

    a second driver circuit over another one of the plurality of third substrates, each of the first driver circuit and the second driver circuit comprising a plurality of thin film transistors comprising a crystalline semiconductor; and

    a liquid crystal layer sandwiched between said first substrate and said second substrate,wherein at least one end surface of said amorphous semiconductor layer of at least one of said reverse stagger type thin film transistors, and at least one end surface of a first conductive layer formed on said amorphous semiconductor layer, are substantially coextensive with each other;

    wherein the plurality of said third substrates are disposed over said first substrate; and

    wherein the plurality of thin film transistors of the first driver circuit comprises a first gate insulating film and the plurality of thin film transistors of the second driver circuit comprises a second gate insulating film having a different thickness from the first gate insulating film.

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