Method of making a light emitting device having a molded encapsulant
First Claim
1. A method of making a light emitting device, the method comprising:
- (a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated;
(b) providing a transparent mold having a cavity filled with a second polymerizable composition;
(c) polymerizing the second polymerizable composition to form a second partially polymerized composition, wherein polymerizing the second polymerizable composition comprises applying actinic radiation having a wavelength of 700 nm or less; and
(d) inverting the mold to contact the first polymerizable composition and the second partially polymerized composition;
(e) polymerizing the first polymerizable composition to form a first partially polymerized composition, wherein polymerizing the first polymerizable composition comprises applying actinic radiation having a wavelength of 700 nm or less.
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Abstract
Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described.
114 Citations
10 Claims
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1. A method of making a light emitting device, the method comprising:
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(a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a transparent mold having a cavity filled with a second polymerizable composition; (c) polymerizing the second polymerizable composition to form a second partially polymerized composition, wherein polymerizing the second polymerizable composition comprises applying actinic radiation having a wavelength of 700 nm or less; and (d) inverting the mold to contact the first polymerizable composition and the second partially polymerized composition; (e) polymerizing the first polymerizable composition to form a first partially polymerized composition, wherein polymerizing the first polymerizable composition comprises applying actinic radiation having a wavelength of 700 nm or less. - View Dependent Claims (2, 3, 4, 5)
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6. A method of making a light emitting device, the method comprising:
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(a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) polymerizing the second polymerizable composition to form a second partially polymerized composition, wherein polymerizing the second polymerizable composition comprises heating; (d) inverting the mold to contact the first polymerizable composition and the second partially polymerized composition; and (e) polymerizing the first polymerizable composition to form a first partially polymerized composition, wherein polymerizing the first polymerizable composition comprises heating. - View Dependent Claims (7, 8)
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9. A method of making a light emitting device, the method comprising:
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(a) providing an LED package comprising an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition, and partially polymerizing the second polymerizable composition to form a second partially polymerized composition; (c) contacting the first polymerizable composition and the second partially polymerized composition; (d) polymerizing the first polymerizable composition and the second partially polymerized composition to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. - View Dependent Claims (10)
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Specification