Light emitting diode package having anodized insulation layer and fabrication method therefor

• US 8,304,279 B2
• Filed: 08/29/2011
• Issued: 11/06/2012
• Est. Priority Date: 04/05/2006
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Young Ki, Choi, Seog Moon, Shin, Sang Hyun
• Primary Examiner(s): Wagner, Jenny L
• Application Number:
  US13/220,258
• Publication Number:
  US 20110312109A1
• Time in Patent Office: 435 Days
• Field of Search: 438/64, 438/69, 257/E23.101
• US Class Current: 438/69
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials

Abstract

An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.

Claims

1. A method for fabricating a light emitting diode package, comprising:

etching a surface of a substrate to form a reflecting region;

anodizing the substrate to form an insulation layer;

forming patterned electrodes on the substrate;

mounting a light source on the substrate and electrically connecting the light source to the patterned electrodes; and

assembling a lens onto the substrate,

wherein the step of etching a surface of a substrate comprises forming electrode connection grooves adjacent to the reflecting region to electrically connect the light source to the patterned electrodes with wires, and forming lens assembly grooves for defining the location of the lens part on the substrate.

2. The method according to claim 1, further comprising dicing a mother substrate into a plurality of the individual substrate.

3. The method according to claim 1, wherein the substrate is anodized on surfaces thereof to form insulation layers, except on surfaces of the reflecting region so as not to hinder the reflection of light from the light source to the outside.

4. The method according to claim 1, further comprising forming an Al heat radiator under the light source.

5. The method according to claim 4, wherein the insulation layer is formed on a lower surface of the substrate, and surrounds the Al heat radiator to form electric insulation with the substrate.

6. The method according to claim 1, wherein the electrode connection grooves have a depth larger than a depth of the lens assembly grooves.

7. The method according to claim 1, wherein the substrate is made of Al.

8. The method according to claim 1, wherein the assembling a lens onto the substrate includes forming projections on an outer surface of the lens and inserting the projections into the lens assembly grooves.

9. The method according to claim 1, wherein the assembling a lens onto the substrate includes adhering the lens to the substrate so as not to dispose the lens on the electrode connection grooves, so that the wires can be placed in the electrode connection grooves and the lens does not hinder the placement of the wires.