×

Thermal throttling of peripheral components in a processing device

  • US 8,304,698 B1
  • Filed: 12/09/2005
  • Issued: 11/06/2012
  • Est. Priority Date: 12/09/2005
  • Status: Active Grant
First Claim
Patent Images

1. A method comprising:

  • determining whether a temperature of a portion of a die of an integrated circuit device has exceeded a first temperature threshold, wherein the integrated circuit device comprises a central processing unit and one or more peripheral components; and

    in response to determining that the temperature of the portion of the die has exceeded the first temperature threshold;

    selecting a first thermal reduction process for a first peripheral component of the one or more peripheral components; and

    implementing the first thermal reduction process for the first peripheral component.

View all claims
  • 6 Assignments
Timeline View
Assignment View
    ×
    ×