Thermal throttling of peripheral components in a processing device
First Claim
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1. A method comprising:
- determining whether a temperature of a portion of a die of an integrated circuit device has exceeded a first temperature threshold, wherein the integrated circuit device comprises a central processing unit and one or more peripheral components; and
in response to determining that the temperature of the portion of the die has exceeded the first temperature threshold;
selecting a first thermal reduction process for a first peripheral component of the one or more peripheral components; and
implementing the first thermal reduction process for the first peripheral component.
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Abstract
Whether a temperature of a portion of a die of an integrated circuit device having a central processing device and one or more peripheral components has exceeded a first temperature threshold is determined. In response to determining that the temperature of the portion of the die has exceeded the first temperature threshold, a first thermal reduction process for a first peripheral component of the one or more peripheral components is selected and the first thermal reduction process for the first peripheral component is implemented.
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Citations
20 Claims
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1. A method comprising:
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determining whether a temperature of a portion of a die of an integrated circuit device has exceeded a first temperature threshold, wherein the integrated circuit device comprises a central processing unit and one or more peripheral components; and in response to determining that the temperature of the portion of the die has exceeded the first temperature threshold; selecting a first thermal reduction process for a first peripheral component of the one or more peripheral components; and implementing the first thermal reduction process for the first peripheral component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An integrated circuit device comprising:
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a central processing unit disposed at a die; a plurality of peripheral components disposed at the die; a thermal diode disposed at the die; and a thermal throttling component disposed at the die and operably connected to the thermal diode, wherein the thermal throttling component is to; determine whether a temperature of a portion of the die has exceed a first temperature threshold based on an output of the thermal diode; and in response to a determination that the temperature of the portion of the die has exceeded the first temperature threshold; select a first thermal reduction process for a first peripheral component of the plurality of peripheral components; and implement the first thermal reduction process for the first peripheral component. - View Dependent Claims (15, 16, 17)
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18. A method comprising:
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operating a central processing unit of an integrated circuit device in a first operational mode during a first time period; operating a first peripheral component of the integrated circuit device in a second operational mode during the first time period; determining whether a temperature of a portion of a die of the integrated circuit device has exceeded a first temperature threshold, wherein the central processing unit and the first peripheral component are disposed at the die; and in response to determining that the temperature of the portion of the die has exceeded the first temperature threshold; operating the central processing unit in the first operational mode during a first time period subsequent to the first time period; operating the first peripheral component of the integrated circuit device in a third operational mode during the second time period, wherein the first peripheral component has a lower thermal output in the third operational mode than in the second operational mode. - View Dependent Claims (19, 20)
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Specification