Modular high-power drive stack cooled with vaporizable dielectric fluid
First Claim
Patent Images
1. A high power drive stack system comprising:
- a common support structure including;
a system power source,a dielectric fluid cooling system, anda plurality of receivers located in predetermined locations,wherein at least one of the receivers has at least two receiver connectors and the at least two receiver connectors have a predetermined position in one of the receivers;
at least one module including;
a power component,a dielectric fluid cooling circuit associated with the power component, andat least two module connectors,wherein the at least two module connectors are arranged in a predetermined position and electrically coupled to at least a portion of the power component and fluidly coupled to the dielectric fluid cooling circuit associated with the power component; and
each module connector mating with a corresponding receiver connector to form an electrical connection and a fluid connection between the module and the common support structure;
wherein the dielectric fluid cooling system and the dielectric fluid cooling circuit utilize a vaporizable dielectric refrigerant; and
wherein the dielectric fluid cooling system comprises a plurality of fluid conduits, a pump, a condenser, and an evaporator, the evaporator positioned on the at least one module.
2 Assignments
0 Petitions
Accused Products
Abstract
A high power drive stack system is provided which includes a cabinet (20) having a vaporizable dielectric fluid cooling system (110) and a plurality of receivers (22) for accepting a plurality of modules (30) containing power electronics. The modules are removably attachable to the receivers by at least two non-latching, dry-break connectors (210). Each of the at least two connectors providing both a fluid connection and an electrical connection between the cabinet and the module.
52 Citations
13 Claims
-
1. A high power drive stack system comprising:
-
a common support structure including; a system power source, a dielectric fluid cooling system, and a plurality of receivers located in predetermined locations, wherein at least one of the receivers has at least two receiver connectors and the at least two receiver connectors have a predetermined position in one of the receivers; at least one module including; a power component, a dielectric fluid cooling circuit associated with the power component, and at least two module connectors, wherein the at least two module connectors are arranged in a predetermined position and electrically coupled to at least a portion of the power component and fluidly coupled to the dielectric fluid cooling circuit associated with the power component; and each module connector mating with a corresponding receiver connector to form an electrical connection and a fluid connection between the module and the common support structure; wherein the dielectric fluid cooling system and the dielectric fluid cooling circuit utilize a vaporizable dielectric refrigerant; and wherein the dielectric fluid cooling system comprises a plurality of fluid conduits, a pump, a condenser, and an evaporator, the evaporator positioned on the at least one module. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 10, 11)
-
-
9. A high power drive stack system comprising:
-
a common support structure including; a system power source, a dielectric fluid cooling system, and a plurality of receivers located in predetermined locations, wherein at least one of the receivers has at least two receiver connectors and the at least two receiver connectors have a predetermined position in one of the receivers; at least one module including; a power component, a dielectric fluid cooling circuit associated with the power component, and at least two module connectors, wherein the at least two module connectors are arranged in a predetermined position and electrically coupled to at least a portion of the power component and fluidly coupled to the dielectric fluid cooling circuit associated with the power component; and each module connector mating with a corresponding receiver connector to form an electrical connection and a fluid connection between the module and the common support structure; wherein the module further comprises a cold plate operating at the potential of a power component bonded directly to the cold plate.
-
-
12. A high power drive stack system comprising:
-
a common support structure including; a system power source, a dielectric fluid cooling system, and a plurality of receivers located in predetermined locations, wherein at least one of the receivers has at least two receiver connectors and the at least two receiver connectors have a predetermined position in one of the receivers, at least one module including; a power component, a dielectric fluid cooling circuit associated with the power component, and at least two module connectors, wherein the at least two module connectors are arranged in a predetermined position and electrically coupled to at least a portion of the power component and fluidly coupled to the dielectric fluid cooling circuit associated with the power component; and each module connector mating with a corresponding receiver connector to form an electrical connection and a fluid connection between the module and the common support structure; wherein the power component of the at least one module is a silicon disk or die; wherein the at least one module further comprises a heat sink on both sides of the silicon disk or die, wherein the module dielectric fluid cooling circuit passes through both the heat sinks, at least a portion of the module dielectric fluid cooling circuit also providing an electrical connection to the power silicon disk or die.
-
-
13. A high power drive stack system comprising:
-
a common support structure including; a system power source, a dielectric fluid cooling system, and a plurality of receivers located in predetermined locations, wherein at least one of the receivers has at least two receiver connectors and the at least two receiver connectors have a predetermined position in one of the receivers; at least one module including; a power component a dielectric fluid cooling circuit associated with the power component, and at least two module connectors, wherein the at least two module connectors are arranged in a predetermined position and electrically coupled to at least a portion of the power component and fluidly coupled to the dielectric fluid cooling circuit associated with the power component; and each module connector mating with a corresponding receiver connector to form an electrical connection and a fluid connection between the module and the common support structure; wherein the power component of the at least one module is a silicon disk or die; wherein a dielectric fluid of the module dielectric fluid cooling circuit is in direct contact with at least a portion of the silicon disk or die of the module, at least a portion of the module dielectric fluid cooling circuit also providing an electrical connection to the power silicon disk or die.
-
Specification