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Modular high-power drive stack cooled with vaporizable dielectric fluid

  • US 8,305,760 B2
  • Filed: 05/18/2009
  • Issued: 11/06/2012
  • Est. Priority Date: 05/16/2008
  • Status: Expired due to Fees
First Claim
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1. A high power drive stack system comprising:

  • a common support structure including;

    a system power source,a dielectric fluid cooling system, anda plurality of receivers located in predetermined locations,wherein at least one of the receivers has at least two receiver connectors and the at least two receiver connectors have a predetermined position in one of the receivers;

    at least one module including;

    a power component,a dielectric fluid cooling circuit associated with the power component, andat least two module connectors,wherein the at least two module connectors are arranged in a predetermined position and electrically coupled to at least a portion of the power component and fluidly coupled to the dielectric fluid cooling circuit associated with the power component; and

    each module connector mating with a corresponding receiver connector to form an electrical connection and a fluid connection between the module and the common support structure;

    wherein the dielectric fluid cooling system and the dielectric fluid cooling circuit utilize a vaporizable dielectric refrigerant; and

    wherein the dielectric fluid cooling system comprises a plurality of fluid conduits, a pump, a condenser, and an evaporator, the evaporator positioned on the at least one module.

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