Method for placing at least one component provided with connection points on a substrate, as well as such a device

• US 8,306,313 B2
• Filed: 07/02/2008
• Issued: 11/06/2012
• Est. Priority Date: 07/03/2007
• Status: Active Grant

• Current Assignee: Assembleon B.V.
• Original Assignee: Assembleon B.V.
• Inventors: Hoogers, Hubert Francijn Maria
• Primary Examiner(s): Chowdhury, Tarifur
• Assistant Examiner(s): HANSEN, JONATHAN M
• Application Number:
  US12/167,083
• Publication Number:
  US 20090010528A1
• Time in Patent Office: 1,588 Days
• Field of Search: 382/146, 382/151
• US Class Current: 382/151
• CPC Class Codes: H05K 13/0812 the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
• CPC Class Codes: H05K 13/0815 Controlling of component placement on the substrate during or after manufacturing

Abstract

A method for placing at least one component provided with connection points on a substrate. First, positions of the connection points are determined, after which the component is positioned at desired positions on the substrate with the connection points thereof. Upon placement of a number of components, the contour of a component as well as the positions of the connection points relative to said contour are determined for a first number of components. On the basis of the calculated positions of the connection points relative to the contours average positions of the connection points relative to the contour are calculated. Upon placement of a second number of components the contour of a component is determined, whereupon the expected positions of the connection points relative to the contour are calculated on the basis of said average positions.

Claims

1. A method for placing at least one component provided with connection points on a substrate, comprising:

determining a contour of each of a first number of components;

determining positions of the connection points of each of the first number of components;

placing the first number of components at desired positions on the substrate with the connection points;

determining positions of the connection points relative to the contour for each of the first number of components, and calculating average positions of the connection points relative to the contour for the first number of components;

determining a contour of each of a second number of components;

calculating expected positions of the connection points relative to the contour for each of the second number of components on the basis of said average positions for the first number of components; and

placing the second number of components at desired positions on the substrate with the connection points.

2. A method according to claim 1, further comprising:

determining an average deviation between the determined positions and desired positions of the connection points relative to the contour from the determined positions of the connection points relative to the contour; and

determining the calculated expected positions of the connection points relative to the contour on the basis of said average deviation.

3. A method according to claim 1, further comprising picking up each of the first and second number of components with a nozzle, wherein the nozzle includes a sensor configured to determine a position of the contour of each of the first and second number of components relative to the nozzle and wherein the nozzle is movable with respect to a camera for determining the positions of the connection points.

4. A method according to claim 3, wherein the connection points lie in a plane of each of the first and second number of components, and wherein the method further comprises rotating the first and second number of components with respect to the sensor about an axis of rotation that extends transverse to said plane to determine the contour of each of the first and second number of components.

5. A method according to claim 4, wherein said sensor comprises a line array sensor.

6. A method according to claim 3, further comprising taking an image of a plane with the camera in a direction transverse to said plane to determine the positions of the connection points with the image.

7. A method according to claim 6, wherein the camera comprises a CCD sensor.

8. A device suitable for carrying out the method according to claim 1, comprising:

a movable nozzle configured to pick up each of the first and second number of components; and

a camera configured to determine the positions of connection points of each of the first number of components;

a sensor configured to determine a position of a contour of each of the first and second number of components relative to the nozzle;

a mechanism configured to calculate the average positions of the connection points of the first number of components relative to the contour; and

a mechanism configured to calculate the expected positions of connection points of a component of the second number of components whose contour has been determined on the basis of the average positions of the connection points of the first number of components relative to the contour.

9. A device according to claim 8, wherein the nozzle includes the sensor.

10. A device according to claim 8,

wherein the nozzle is configured to rotate about an axis of rotation,

wherein an image field of the sensor extends parallel to the axis of rotation, and

wherein an image field of the camera extends transverse to the axis of rotation.

11. A device according to claim 8, wherein said sensor comprises a line array sensor.

12. A device according to claim 8, wherein said camera comprises a CCD sensor.

13. A method according to claim 1, further comprising obtaining the first and second number of components from the same wafer.