Method for placing at least one component provided with connection points on a substrate, as well as such a device
First Claim
1. A method for placing at least one component provided with connection points on a substrate, comprising:
- determining a contour of each of a first number of components;
determining positions of the connection points of each of the first number of components;
placing the first number of components at desired positions on the substrate with the connection points;
determining positions of the connection points relative to the contour for each of the first number of components, and calculating average positions of the connection points relative to the contour for the first number of components;
determining a contour of each of a second number of components;
calculating expected positions of the connection points relative to the contour for each of the second number of components on the basis of said average positions for the first number of components; and
placing the second number of components at desired positions on the substrate with the connection points.
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Accused Products
Abstract
A method for placing at least one component provided with connection points on a substrate. First, positions of the connection points are determined, after which the component is positioned at desired positions on the substrate with the connection points thereof. Upon placement of a number of components, the contour of a component as well as the positions of the connection points relative to said contour are determined for a first number of components. On the basis of the calculated positions of the connection points relative to the contours average positions of the connection points relative to the contour are calculated. Upon placement of a second number of components the contour of a component is determined, whereupon the expected positions of the connection points relative to the contour are calculated on the basis of said average positions.
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Citations
13 Claims
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1. A method for placing at least one component provided with connection points on a substrate, comprising:
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determining a contour of each of a first number of components; determining positions of the connection points of each of the first number of components; placing the first number of components at desired positions on the substrate with the connection points; determining positions of the connection points relative to the contour for each of the first number of components, and calculating average positions of the connection points relative to the contour for the first number of components; determining a contour of each of a second number of components; calculating expected positions of the connection points relative to the contour for each of the second number of components on the basis of said average positions for the first number of components; and placing the second number of components at desired positions on the substrate with the connection points. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification