High throughput chemical mechanical polishing system

• US 8,308,529 B2
• Filed: 04/21/2009
• Issued: 11/13/2012
• Est. Priority Date: 04/25/2008
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: D'Ambra, Allen L., Yilmaz, Alpay
• Primary Examiner(s): Shakeri, Hadi
• Application Number:
  US12/427,411
• Publication Number:
  US 20090270015A1
• Time in Patent Office: 1,302 Days
• Field of Search: 451/28, 451/41, 451/54, 451/56, 451/57, 451/60, 451/114, 451/159, 451/259, 451/285, 451/287, 451/332, 451/65
• US Class Current: 451/65
• CPC Class Codes: B24B 27/0076 grinding machines comprising two or more grinding tools
• CPC Class Codes: B24B 37/042 operating processes therefor
• CPC Class Codes: B24B 37/345 Feeding, loading or unloading work specially adapted to lapping
• CPC Class Codes: B24B 41/005 Feeding or manipulating devices specially adapted to grinding machines feeding, loading or unloading work specially adapted to lapping machines B24B37/345

Abstract

Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module, a cleaner and a robot. The robot has a range of motion sufficient to transfer substrates between the polishing module and cleaner. The polishing module includes at least two polishing stations, at least one load cup and at least four polishing heads. The polishing heads are configured to move independently between the at least two polishing stations and the at least one load cup.

Claims

1. A polishing system comprising:

a polishing module;

a cleaner; and

a robot having a range of motion sufficient to transfer substrates between the polishing module and cleaner, the polishing module comprising;

at least two polishing stations, wherein the at least two polishing stations each have a platen assembly configured to support a polishing pad;

at least one load cup; and

at least four polishing heads, wherein each of the polishing heads is configured to move independently between each of the at least two polishing stations and the at least one load cup, and

wherein the at least four polishing heads are coupled to an overhead circular track.

2. The polishing module of claim 1, wherein the cleaner comprises:

two cleaning modules, each cleaning module comprising a megasonic cleaning module, a brush box, a fluid jet module and a dryer.

3. The polishing module of claim 2, wherein the cleaner comprises:

a transfer mechanism having two pairs of gripper assemblies, wherein a first pair of the gripper assemblies is positioned to service a front end of each cleaning module and a second pair of the gripper assemblies is positioned to service a back end of each cleaning module.

4. The polishing module of claim 3 further comprising:

a shuttle configured to move substrate between the robot and the transfer mechanism.

5. The polishing module of claim 1, wherein each of said platen assemblies have a sufficient area to accommodate simultaneous interface with two polishing head during polishing.

6. The polishing module of claim 5, wherein the polish module comprises:

two conditioning modules and two polishing fluid delivery modules configured to interface with a polishing surface supported on the platen during polishing.

7. A polishing system comprising:

a polishing module comprising;

at least two polishing stations, wherein the at least two polishing stations each have a platen assembly configured to support a polishing pad;

at least two load cups;

a plurality of carriers coupled to an overhead circular track disposed over the at least two polishing stations, the carriers independently rotatable along the overhead track; and

at least two polishing heads, each polishing head coupled to a respective one of the carriers, wherein the carriers are configured to independently position the polishing heads over each of the at least two polishing stations and the at least two load cups.

8. The polishing system of claim 7, further comprising:

a cleaner coupled to the polishing module, wherein the cleaner includes at least two cleaning modules, each cleaning module comprising a megasonic cleaning module, a brush box, a fluid get module and a dryer.

9. The polishing system of claim 8, further comprising:

a shuttle configured to move a substrate from the load cups to the cleaner.

10. The polishing system of claim 8, further comprising:

a robot configured to move a substrate between the polishing module and the cleaner.

11. The polishing system of claim 7, wherein each of said platen assemblies have a sufficient area to accommodate simultaneous interface with two polishing heads during polishing.

12. The polishing system of claim 7, further comprising:

an accessory device coupled to one of the carriers.