Systems and methods for magnetron deposition

• US 8,308,915 B2
• Filed: 09/14/2006
• Issued: 11/13/2012
• Est. Priority Date: 09/14/2006
• Status: Expired due to Fees

• Current Assignee: 4D-S Pty, Ltd.
• Original Assignee: 4D-S Pty, Ltd.
• Inventors: Nagashima, Makoto
• Primary Examiner(s): Hendricks, Keith
• Assistant Examiner(s): BERMAN, JASON
• Application Number:
  US11/522,081
• Publication Number:
  US 20080067063A1
• Time in Patent Office: 2,252 Days
• Field of Search: 204/298.12, 204/298.26, 204/192.12, 204/298.23, 204/298.25
• US Class Current: 204/192.12
• CPC Class Codes: C23C 14/08 Oxides C23C14/10 takes precedence
• CPC Class Codes: C23C 14/352 using more than one target C23C14/56 takes precedence
• CPC Class Codes: C23C 14/358 Inductive energy
• CPC Class Codes: H01J 37/3408 Planar magnetron sputtering
• CPC Class Codes: H01J 37/3438 Electrodes other than cathode
• CPC Class Codes: H01J 37/3452 Magnet distribution

Abstract

Systems and methods are disclosed for face target sputtering to fabricate semiconductors by providing one or more materials with differential coefficients of expansion in the FTS chamber; and generating a controlled pressure and size with the one or more materials during sintering.

Claims

1. A method for forming a non-planar complex metal oxide (CMO) target in a face target sputtering (FTS) chamber, comprising:

providing one or more materials with differential coefficients of expansion in the FTS chamber, the materials forming two precision cylinders that are concentric to each other and have different coefficients of thermal expansion;

providing complex metal oxide between the two precision cylinders;

generating a controlled pressure and size with the one or more materials during sintering of the complex metal oxide in the FTS chamber; and

thus forming the non-planar complex metal oxide target;

wherein the FTS sputtering chamber includes;

an air-tight chamber in which an inert gas is admittable and exhaustible;

a facing magnetron; and

a substrate holder adapted to hold a substrate on which a thin film is to be deposited.

2. The method of claim 1, further comprising providing an inner pressure ring within an outer casing wherein the inner pressure ring is surrounded by two precision cylinders that are concentric to each other and have different coefficients of thermal expansion.

3. The method of claim 2, wherein the outer casing comprises a low expansion alloy.

4. The method of claim 2, comprising changing the size of the inner pressure ring with temperature while the outer casing is kept at constant shape.

5. The method of claim 2, comprising exerting force on a sintered powder of complex metal oxide.

6. The method of claim 5, wherein the force and temperature compact the sintered powder and create a solid.

7. The method of claim 2, wherein the facing magnetron further comprises inner and outer cylindrical magnets respectively disposed adjacent to the target such that magnetic poles of different polarities face each other across a plasma region thereby to establish a magnetic field.

8. The method of claim 1, wherein the target is one of:

a cross-shaped target and a circular target.

9. The method of claim 1, further comprising providing one or more strips which interlocks to approximate a circular shape.

10. The method of claim 9, wherein the strips have a backing plate for cooling and electrode attachment.

11. The method of claim 1, wherein the facing magnetron comprises four source sub-chambers adjacent to each other comprise shared walls and shared magnets within the air-tight chamber in a cross-type configuration.

12. The method of claim 11, wherein the four source sub-chambers yield a four-fold pattern which uniformly increases deposition coverage on a target substrate, and each sub-chamber yields a cosine distribution which is additive since the chambers are close in proximity.

13. The method of claim 11, wherein the facing magnetron further comprises inner and outer cylindrical magnets respectively disposed adjacent to the sub-chambers such that magnetic poles of different polarities face each other across a plasma region thereby to establish a magnetic field generated from the four source sub-chambers.

14. A method of deposition, comprising:

providing a face target sputtering system, the system comprising a face target sputtering chamber, and the face target sputtering chamber comprising;

an air-tight chamber in which an inert gas is admittable and exhaustible;

a facing magnetron; and

a substrate holder adapted to hold a substrate on which a film is to be deposited;

forming a non-planar complex metal oxide target, the target formed in the face target sputtering chamber by;

providing one or more materials with differential coefficients of expansion in the FTS chamber, the materials forming two precision cylinders that are concentric to each other and have different coefficients of thermal expansion;

providing complex metal oxide between the two precision cylinders; and

generating a controlled pressure and size with the one or more materials during sintering of the complex metal oxide in the FTS chamber; and

sputtering the non-planar complex metal oxide target, thus depositing metal oxide on the substrate.

15. The method of claim 14, wherein the complex metal oxide is Praseodymium Calcium Manganese Oxide (PCMO).

16. The method of claim 14, further comprising depositing a metal on the substrate.

17. The method of claim 14, further comprising forming a barrel-shaped magnetic field in the facing magnetron.

18. The method of claim 14, further comprising placing the target at an oblique angle to the substrate holder.

19. The method of claim 14, further comprising providing an additional electron-ion magnetron excitation coil to increase the number of positive ions depositing on the substrate.