Manufacturing method of three-dimensional structure

• US 8,309,176 B2
• Filed: 06/04/2009
• Issued: 11/13/2012
• Est. Priority Date: 06/09/2008
• Status: Expired due to Fees

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Isano, Taisuke, Asano, Kosuke, Kaneda, Yasushi
• Primary Examiner(s): Empie, Nathan
• Assistant Examiner(s): Jiang, Lisha
• Application Number:
  US12/478,298
• Publication Number:
  US 20090304928A1
• Time in Patent Office: 1,258 Days
• Field of Search: 156/155
• US Class Current: 427/259
• CPC Class Codes: B05D 5/00 Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
• CPC Class Codes: B81C 1/00126 Static structures not provided for in groups B81C1/00031 - B81C1/00119
• CPC Class Codes: B81C 2201/0108 Sacrificial polymer, ashing of organics
• CPC Class Codes: B81C 2203/038 Bonding techniques not provided for in B81C2203/031 - B81C2203/037

Abstract

A method for manufacturing a three-dimensional structure includes forming a first structure having a relief pattern on a substrate, forming a sacrifice layer on the first structure such that the sacrifice layer can be filled in a concave part of the first structure and the sacrifice layer can cover a surface of a convex part of the first structure on a side opposite to the substrate, forming a second structure having a relief pattern on the sacrifice layer, and a fourth step of removing the sacrifice layer from between the first structure and the second structure, and thereby bringing the second structure into contact with the surface of the first structure.

Claims

1. A method of manufacturing a three-dimensional structure, the method comprising:

a first step of forming a first structure having a relief pattern on a substrate;

a second step of forming a sacrifice layer on the first structure such that the sacrifice layer can be filled in a concave part of the first structure and the sacrifice layer can cover a surface of a convex part of the first structure on a side opposite to the substrate;

a third step of forming a second structure having a relief pattern on the sacrifice layer; and

a fourth step of removing the sacrifice layer from between the first structure and the second structure to bring the second structure into contact with the surface of the first structure.

2. The method according to claim 1, wherein the first step forms a layer of the first structure on the substrate.

3. The method according to claim 1, wherein the first step forms the first structure through photolithography or imprinting.

4. The method according to claim 1, further comprising the steps of:

forming, after the fourth step, the sacrifice layer on the second structure such that the sacrifice layer can be filled in a concave part of the second structure and the sacrifice layer can cover a surface of a convex part of the second structure on a side opposite to the substrate;

forming a third structure having a relief pattern on the sacrifice layer; and

removing the sacrifice layer from between the second structure and the third structure to bring the third structure into contact with the surface of the second structure.

5. The method according to claim 1, further comprising, between the third step and the fourth step:

forming the sacrifice layer on the second structure such that the sacrifice layer can be filled in a concave part of the second structure and the sacrifice layer can cover a surface of a convex part of the second structure on a side opposite to the substrate; and

forming a third structure having a relief pattern on the sacrifice layer,

wherein the fourth step simultaneously removes a plurality of the sacrifice layers.

6. The method according to claim 1, wherein the fourth step uses a dry process with a pressure set to 10 Pa or higher.