Flexible substrate and method for fabricating flexible display device having the same

• US 8,309,379 B2
• Filed: 07/19/2010
• Issued: 11/13/2012
• Est. Priority Date: 09/16/2009
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: Yoo, Juhn-Suk, Yoon, Soo-Young, Park, Dong-sik
• Primary Examiner(s): Landau, Matthew
• Assistant Examiner(s): Nicely, Joseph C
• Application Number:
  US12/838,920
• Publication Number:
  US 20110062444A1
• Time in Patent Office: 848 Days
• Field of Search: 438/30, 438/34, 257/E33.004, 257/E21.7, 156/272.8, 156/712, 349/158
• US Class Current: 438/34
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate

Abstract

A method for fabricating a flexible display device including the steps of preparing a glass substrate, forming a flexible substrate on the glass substrate, the flexible substrate being formed by forming a semiconductor layer on the glass substrate, forming a first flexible layer on the semiconductor layer, forming an adhesive layer on the first flexible layer, and forming a second flexible layer on the adhesive layer, forming a thin film array on the flexible substrate, forming a display device on the thin film array, and separating the glass substrate from the semiconductor layer of the flexible substrate.

Claims

1. A method for fabricating a flexible display device including the steps of:

preparing a glass substrate;

forming a flexible substrate on the glass substrate, the flexible substrate being formed by forming a semiconductor layer on the glass substrate, forming a first flexible layer on the semiconductor layer, forming an adhesive layer on the first flexible layer, and forming a second flexible layer on the adhesive layer;

forming a thin film array on the flexible substrate;

forming a display device on the thin film array; and

separating the glass substrate from the semiconductor layer of the flexible substrate.

2. The method for fabricating the flexible display device according to claim 1 wherein the glass substrate is separated from the semiconductor layer of the flexible substrate by irradiating a laser beam to a back side of the glass substrate.

3. The method for fabricating the flexible display device according to claim 2 wherein the glass substrate includes silicon, and the semiconductor layer includes one of hydrogenated silicon or hydrogenated and impurity doped amorphous silicon, the glass substrate being separated from the semiconductor layer by breaking the coupling between the silicon of the glass substrate and the hydrogen of the semiconductor layer.

4. The method for fabricating the flexible display device according to claim 1 wherein the thin film array is a thin film array for a liquid crystal display device, organic electroluminescence display device, or electrophoretic display device.

5. The method for fabricating the flexible display device according to claim 1 wherein the first flexible layer and the second flexible layer is formed from one of polyethylene naphthalate PEN, polyethylene terephthalate PET, polyethylene ether phthalate, polycarbonate, polyarylate, polyether imide, polyether sulfonate, polyimide, and polyacrylate.

6. The method for fabricating the flexible display device according to claim 1 wherein the second flexible layer is thicker than the first flexible layer.

7. The method for fabricating the flexible display device according to claim 1 further including the step of connecting a driving device for driving the thin film transistor array to the flexible substrate.

8. The method for fabricating the flexible display device according to claim 1 wherein the adhesive layer is a waterproof thermosetting adhesive.