Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof
First Claim
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1. A method for fabricating an encapsulant cavity integrated circuit package system comprising:
- providing an interposer;
forming a first integrated circuit package, with an inverted bottom terminal, having an integrated circuit, an encapsulant cavity, and the interposer; and
attaching a component on the interposer in the encapsulant cavity, the integrated circuit electrically connected to a side of the interposer facing away from the component.
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Abstract
A method for fabricating an encapsulant cavity integrated circuit package system includes: providing an interposer; forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and the interposer; and attaching a component on the interposer in the encapsulant cavity.
301 Citations
10 Claims
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1. A method for fabricating an encapsulant cavity integrated circuit package system comprising:
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providing an interposer; forming a first integrated circuit package, with an inverted bottom terminal, having an integrated circuit, an encapsulant cavity, and the interposer; and attaching a component on the interposer in the encapsulant cavity, the integrated circuit electrically connected to a side of the interposer facing away from the component. - View Dependent Claims (2, 3, 4, 5)
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6. An encapsulant cavity integrated circuit package system comprising:
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an interposer; a first integrated circuit package, with an inverted bottom terminal, having an integrated circuit, an encapsulant cavity, and the interposer; and a component on the interposer in the encapsulant cavity, the integrated circuit electrically connected to a side of the interposer facing away from the component. - View Dependent Claims (7, 8, 9, 10)
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Specification