System and method of dosage profile control

• US 8,309,444 B2
• Filed: 07/07/2010
• Issued: 11/13/2012
• Est. Priority Date: 07/07/2010
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Hui, Keung, Mou, Jong-I, Chang, Chun-Lin
• Primary Examiner(s): Rizkallah, Kimberly
• Assistant Examiner(s): Laurenzi, Mark A
• Application Number:
  US12/831,699
• Publication Number:
  US 20120009692A1
• Time in Patent Office: 860 Days
• Field of Search: 250/491.1, 250/491.2, 250397-398, 250/492.21, 438/535, 438510-520, 438/527, 438/914, 438/951, 257/E21.147
• US Class Current: 438/514
• CPC Class Codes: C23C 14/48 Ion implantation
• CPC Class Codes: H01J 2237/30461 pre-calculated
• CPC Class Codes: H01J 2237/31703 Dosimetry
• CPC Class Codes: H01J 37/302 Controlling tubes by external information, e.g. programme control H01J37/304 takes precedence
• CPC Class Codes: H01J 37/304 Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
• CPC Class Codes: H01J 37/3171 for ion implantation plasma immersion ion implantation H01J37/32412
• CPC Class Codes: H01L 21/265 producing ion implantation
• CPC Class Codes: H01L 22/14 for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means

Abstract

A system and method for controlling a dosage profile is disclosed. An embodiment comprises separating a wafer into components of a grid array and assigning each of the grid components a desired dosage profile based upon a test to compensate for topology differences between different regions of the wafer. The desired dosages are decomposed into directional dosage components and the directional dosage components are translated into scanning velocities of the ion beam for an ion implanter. The velocities may be fed into an ion implanter to control the wafer-to-beam velocities and, thereby, control the implantation.

Claims

1. A method for manufacturing semiconductor devices, the method comprising:

providing a semiconductor wafer;

separating the semiconductor wafer into at least a first cell and a second cell;

assigning the first cell a first dosage and assigning the second cell a second dosage;

decomposing the first dosage into a first dimension component and a second dimension component;

decomposing the second dosage into a third dimension component and a fourth dimension component;

converting the first dimension component into a first velocity, converting the second dimension component into a second velocity, converting the third dimension component into a third velocity, and converting the fourth dimension component into a fourth velocity;

implanting dopants into the first cell using the first velocity and the second velocity, the implanting dopants being performed with an ion implanter; and

implanting dopants into the second cell using the third velocity and the fourth velocity, the implanting dopants being performed with the ion implanter.

2. The method of claim 1, further comprising optimizing the first dimension component and the second dimension component after the decomposing the first dosage.

3. The method of claim 2, wherein the optimizing the first dimension component and the second dimension component is performed by minimizing the least square errors.

4. The method of claim 1, wherein the converting the first dimension component, the converting the second dimension component, the converting the third dimension component, and the converting the fourth dimension component are performed using a dosage to speed conversion factor.

5. The method of claim 4, wherein the dosage to speed conversion factor is determined empirically.

6. The method of claim 1, wherein the assigning the first cell the first dosage further comprises performing a wafer acceptance test or an inline measurement.

7. The method of claim 1, wherein the first velocity is divided by a number of passes made by the ion implanter along a first direction.

8. A method for implanting dopants comprising:

providing a substrate;

separating the substrate into a plurality of cells;

determining a dosage for each one of the plurality of cells;

decomposing the dosage for each one of the plurality of cells into directional components;

translating the directional components into directional velocities for each one of the plurality of cells, the translating the directional components using at least one conversion factor;

applying the directional velocities to a substrate control system; and

implanting ions into the plurality of cells as the substrate and an ion beam move relative to each other at the directional velocities for each respective cell into which the ion beam is implanting ions.

9. The method of claim 8, further comprising performing an optimization of the directional components.

10. The method of claim 9, wherein the optimization is performed at least in part through a minimization of the least squares error.

11. The method of claim 8, further comprising determining the at least one conversion factor empirically.

12. The method of claim 8, wherein the determining the dosage for each cell further comprises performing a wafer acceptance test or an inline measurement.

13. The method of claim 8, wherein the directional velocities include a first velocity along a first direction and a second velocity along a second direction perpendicular to the first direction.

14. The method of claim 8, wherein the ion beam is fixed and the wafer moves relative to the ion beam.

15. The method of claim 8, wherein the wafer remains fixed and the ion beam is moved relative to the wafer.

16. The method of claim 8, further comprising optimizing the directional velocities.